Following the acceptance of the IPO application by Tianyu Semiconductor on the main board of the Hong Kong Stock Exchange (HKEX) on December 23, 2024, two other Chinese third-generation semiconductor companies, Innoscience and SICC, have also made moves towards listing on the Hong Kong market. Among...

On November 13, at Semicon Europe 2024 in Munich, Germany, China's silicon carbide (SiC) substrate manufacturer, SICC, announced the launch of the industry's first 300mm (12-inch) silicon carbide substrate. This marks a significant step into the era of ultra-large silicon carbide substrates. SICC...

On March 27, Wolfspeed announced the topping out of construction at the its largest and most advanced John Palmour Manufacturing Center for Silicon Carbide. According to its introduction, the "John Palmour Silicon Carbide Manufacturing Center" has a total investment of USD 5 billion, covering 44...

Infineon, Hyundai, and Kia announced on October 18 that they have signed a multi-year agreement for the supply of SiC (Silicon Carbide) and Si (Silicon) power semiconductor modules and chips. Under this agreement, Infineon will supply SiC and Si power components to Hyundai and Kia until 2030, and...