As silicon photonics has become a key technology in the AI era, semiconductor giants, including Intel and TSMC, have joined the battlefield. Now another tech giant has engaged in the war, while U.S. chip giant AMD is reportedly seeking silicon photonics partners in Taiwan, according to local media U...

If you happen to be a technology enthusiast, June would certainly be a month to watch. NVIDIA CEO Jensen Huang, joined by AMD CEO Lisa Su, visited Taiwan to announce their product roadmaps in COMPUTEX 2024. NVIDIA unveiled its new generation Rubin architecture, indicating that the R series products ...

TSMC today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading nanoshe...

As generative AI applications fuel the era of high computing power, Foxconn's connector subsidiary FIT announced on March 25th a cross-industry collaboration with MediaTek. Together, they will develop next-generation high-speed connectivity solutions, specifically Co-Packaged Optics (CPO), aiming to...

MediaTek has reportedly made its foray into the booming field of Heterogeneous Integration Co-Packaged Optics (CPO), announcing on March 20th a partnership with optical communications firm Ranovus to launch a customized Application-Specific Integrated Circuit (ASIC) design platform for CPO. This pla...