MediaTek has reportedly made its foray into the booming field of Heterogeneous Integration Co-Packaged Optics (CPO), announcing on March 20th a partnership with optical communications firm Ranovus to launch a customized Application-Specific Integrated Circuit (ASIC) design platform for CPO. This pla...

Kevin Zhang, Senior Vice President of Business Development at TSMC, introduced the company's latest technologies at the International Solid-State Circuits Conference (ISSCC) 2024. According to TechNews citing from the speech, Zhang shared insights into future technological advancements, prospects fo...

Japanese telecommunications operator NTT is reportedly collaborating with American chipmaker Intel and other semiconductor manufacturers to research large-scale production of next-generation semiconductor technology, which involves significantly reducing power consumption using optical technology. ...

The Center for Strategic and International Studies (CSIS) in the United States published a new article on the January 12th, 2024, suggesting that the new battleground in the US-China tech war could be silicon photonics technology. This technology aims to enhance transmission efficiency, reduce laten...

According to a report from Taiwan's Commercial Times, industry experts assert that Silicon Photonics (SiPh) is poised to revolutionize the cloud industry as communication transmission speeds surge beyond 1.6 Tbps. Utilizing Co-Packaged Optics (CPO) for integration, SiPh combines optical components a...