As designing and manufacturing large monolithic ICs became more complex, related challenges regarding yield and cost have emerged for semiconductor companies, which boosts the popularity of chiplets. Now the wave has been spreading to the memory sector. According to a report by TheElec, SK hynix int...

In mid-August, Samsung is said to be accelerating its progress on next-gen HBM, targeting to tape-out HBM4 by the end of this year. Now it seems SK hynix has maintained its competitive edge, as the company aims to tape out HBM4 in October, which will be used to power NVIDIA's Rubin AI chips, accordi...

Kioxia has moved forward with its plans to go public, starting the process on August 23. This development follows Bain Capital, a U.S. private equity firm with a majority stake in Kioxia, submitting an application for the listing to the Tokyo Stock Exchange on the same day, according to Nikkei. K...

According to a report from the Commercial Times, SK hynix is expected to announce a plan of closer collaboration with TSMC and NVIDIA during the Semicon Taiwan exhibition in September, which is likely to focusing on the development of next-generation HBM. This partnership is expected to further st...

HBM4, the sixth generation of HBM, is poised to become the key to breakthroughs in computing power for next-generation CSPs (Cloud Service Providers). According to a report from Commercial Times citing Global Unichip Corp. (GUC), to support the development of HBM4, their semiconductor IP (Intellectu...