As per a report from Korea Economic Daily citing unnamed sources on July 15th, Samsung Electronics is preparing to mass-produce the logic die for HBM4 using its advanced 4nm process. The logic die, situated at the bottom of the chip stack, is a core component of HBM. Memory manufacturers are alr...

As top memory giants and AI chip companies all gear up for the combat of next-gen high bandwidth memory (HBM), JEDEC, the leader in the development of standards for the microelectronics industry, revealed the preliminary specifications of HBM4 last week. According to its press release and a report f...

The semiconductor industry, driven by AI, is entering a new upward cycle. According to a forecast report from SEMI, after the trough in 2023, the total sales of equipment in 2024 will hit a new high, with growth momentum continuing into 2025. Among this trend, per a report from Commercial Times, ma...

According to a report from BusinessKorea, memory giant SK hynix is deepening its collaboration with TSMC and NVIDIA, and will announce a closer partnership at the Semicon Taiwan exhibition in September. SK hynix has been collaborating with TSMC for many years. In 2022, TSMC announced the establi...

According to a report from Commercial Times, SK Hynix, Samsung, and Micron, the world's top three memory manufacturers, are actively investing in high-bandwidth memory (HBM) capacity expansion plans. Industry sources cited by the same report estimate that by 2025, the additional production will r...