According to a report from Korean media outlet Korea Economic Daily (KED), South Korean tech giant Samsung Electronics is looking to borrow up to KRW 5 trillion (approximately USD 3.6 billion) from the state-run Korea Development Bank (KDB) to finance its expansion of chip production facilities both...

After ending production cuts amidst a recovery in the memory industry, Kioxia disclosed its plans on the 3D NAND roadmap last week. According to reports from PC Watch and Blocks & Files, Kioxia stated that achieving a 1,000-layer level by 2027 would be possible. According to the reports, the ...

AI applications is driving the memory market forward, with HBM (High Bandwidth Memory) undoubtedly being a sought-after product of the industry, attracting increased capital expenditure and production expansion from memory manufacturers. At the meantime, a new force in the memory market has quietly ...

Driven by memory giants ramping up high-bandwidth memory (HBM) production, according to a report from Korean media outlet TheElec, ASMPT, a back-end equipment maker, has supplied a demo thermal compression (TC) bonder for Micron's HBM production. TC bonders play a pivotal role in HBM production...

According to a report by Korean media outlet Business Korea, SK Hynix recently shared its latest breakthrough on its 3D DRAM at VLSI 2024 last week, announcing that the manufacturing yield of its 5-layer stacked 3D DRAM has reached 56.1%. This means that out of roughly 1,000 3D DRAM units manu...