SK Hynix


2024-04-19

[News] SK Hynix Partners with TSMC to Strengthen HBM Technological Leadership

South Korean memory giant SK Hynix announced today that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HB...

2024-04-17

[News] Korean NAND Flash Manufacturers Cautiously Increase Wafer Input, Capacity Utilization Maintains Around 50%

According to a report from South Korean media The Chosun Daily, Samsung Electronics is set to increase wafer input by approximately 30% this quarter at its NAND Flash production lines in Pyeongtaek, South Korea, and Xi'an, China. However, Samsung remains cautious about further production increases t...

2024-04-16

[News] Intensifying Battle of Technology Among Storage Giants

AI and big data are driving a massive demand for memory data, which also imposes higher requirements on memory technologies. Against this backdrop, the technology competition among memory giants is heating up. In terms of NAND Flash, major companies are focusing on breakthroughs in the number of ...

2024-04-02

[News] Samsung Reportedly Establishes New HBM Team, Looking to Improve AI Chip Yield

Samsung Electronics Co. has recently established a HBM team within its memory division, with the goal of enhancing yield during the development of the sixth-generation AI memory HBM4 and the AI accelerator Mach-1. According to a report of the Korea Economic Daily (KED) citing industry sources ...

2024-03-28

[News] Memory Manufacturers Vie for HBM3e Market

Recently, South Korean media Alphabiz reported that Samsung may exclusively supply 12-layer HBM3e to NVIDIA. The report indicates NVIDIA is set to commence large-scale purchases of Samsung Electronics' 12-layer HBM3e as early as September, who will exclusively provide the 12-layer HBM3e to NVIDIA...

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