Amidst the AI boom, HBM technology steps into the spotlight as market demand continues to surge. Global market research firm TrendForce anticipates a 58% year-on-year increase in HBM demand in 2023, with a potential additional growth of approximately 30% in 2024.

Compared to traditional DRAM, HBM (High Bandwidth Memory) boasts advantages such as high bandwidth, high capacity, low latency, and low power consumption. These attributes accelerate AI data processing and make it particularly well-suited for high-performance computing scenarios like ChatGPT. As a result, it has gained popularity, and major storage manufacturers are actively driving HBM technology upgrades.

Leading memory manufacturers are intensifying their efforts, with Samsung set to introduce HBM4.

Since the inception of the first HBM products utilizing TSV packaging technology in 2014, HBM technology has seen multiple upgrades, including HBM, HBM2, HBM2E, HBM3, and HBM3e.

Regarding the SK Hynix and Samsung, two major South Korean companies, have been at the forefront of HBM3 development. NVIDIA’s H100/H800 and AMD’s MI300 series, represent HBM3’s progress. Both SK Hynix and Samsung expected to offer HBM3e samples by the first quarter of 2024. On the other hand, Micron, a U.S.-based memory company, is bypassing HBM3 and directly pursuing HBM3e.

HBM3e will feature 24Gb mono die stacks, and with an 8-layer (8Hi) configuration, a single HBM3e chip’s capacity will soar to 24GB. This advancement is expected to be incorporated into NVIDIA’s GB100 in 2025, leading the three major OEMs to plan HBM3e sample releases in the first quarter of 2024 and enter mass production in the latter half of the year.

In addition to HBM3 and HBM3e, the latest updates indicate that storage giants are planning the launch of the next generation of HBM—HBM4.

Samsung recently announced that it has developed 9.8Gbps HBM3E and is planning to provide samples to customers. Furthermore, Samsung is actively working on HBM4 with a goal to begin supply in 2025. It’s reported that Samsung Electronics is developing technologies such as non-conductive adhesive film (NCF) assembly for optimizing high-temperature thermal characteristics, as well as hybrid bonding (HCB), for HBM4 products.

In September, Korean media reported that Samsung is gearing up to revamp its production process and launch HBM4 products to capture the rapidly growing HBM market. HBM4 memory stacks will feature a 2048-bit memory interface, a significant departure from the previous 1024-bit interface for all HBM stacks. This enhanced interface width holds great significance for the evolution of HBM4.

While HBM4 promises a major breakthrough, it is still a ways off, making it too early to discuss its practical applications and widespread adoption. Industry experts emphasize that the current HBM market is dominated by HBM2e. However, HBM3 and HBM3e are poised to take the lead in the near future.

According to TrendForce’s research, HBM2e currently accounts for the mainstream market share, being used in various products like NVIDIA A100/A800, AMD MI200, and many AI accelerators developed by CSPs. To keep pace with the evolving demands of AI accelerator chips, OEMs are planning to introduce new HBM3e products in 2024, with HBM3 and HBM3e expected to become the market’s primary players next year.

In terms of the demand transition between different HBM generations, TrendForce estimates that in 2023, mainstream demand will shift from HBM2e to HBM3, with estimated demand shares of approximately 50% and 39%, respectively. As more HBM3-based accelerator chips enter the market, demand will substantially shift toward HBM3 in 2024, surpassing HBM2e and accounting for an estimated 60% of the market. This transition, coupled with higher average selling prices (ASP), is poised to significantly drive HBM revenue growth next year.

(Photo credit: Samsung)

Despite facing economic challenges and the impact of high inflation, the flash memory market finds itself in a challenging period. Nevertheless, major DRAM manufacturers continue the pursuit of advanced technology.

For DRAM chips, advanced manufacturing processes mean improved energy efficiency, increased capacity, and an enhanced end-user experience. Currently, in the world of advanced DRAM processes, such as the 10nm class, has reached the fifth generation. Micron refers to it as 1β DRAM, while Samsung calls it 1b DRAM.

Since Micron commenced production of 1β DRAM last October, they have set their sights on producing 1γ DRAM by 2025. This will mark Micron’s first foray into extreme ultraviolet (EUV) lithography technology, and for now, EUV production is centered in their Taichung facility in Taiwan. Therefore, the 1γ process is expected to kick off production there, with potential expansion to their Japanese facilities in the future. Samsung, on the other hand, plans to enter the 1bnm process stage in 2023, achieving chip capacities ranging from 24Gb (3GB) to 32Gb (4GB) and native speeds of 6.4 to 7.2Gbps.

In the NAND Flash business, the technology has now exceeded the remarkable milestone of 200-layer stacking, with storage manufacturers relentlessly striving for even higher layer counts. On August 9th, SK Hynix showcased the world’s first 321-layer NAND Flash memory sample during the 2023 Flash Memory Summit. This innovation has increased efficiency by 59% compared to the previous 238-layer 512Gb NAND. SK Hynix plans to further refine the 321-layer NAND Flash and intends to commence production in the first half of 2025.

Furthermore, Micron has ambitious plans beyond 232 layers, with products like 2YY, 3XX, and 4XX on the horizon. Kioxia and Western Digital are also actively exploring 3D NAND technology with more than 300, 400, and 500 layers. Samsung is planning to introduce the ninth generation of 3D NAND in 2024, possibly featuring 280 layers, followed by the tenth generation in 2025-2026, potentially reaching 430 layers. Their ultimate goal is to achieve 1000-layer NAND Flash by 2030.

(Image: SK Hynix)

Source to UDN, the DRAM market has been buzzing with positive developments lately, and may get a chance to see an upturn by the end of the year. Among the key factors driving this optimism is the DDR5 specification DRAM, which is poised to capitalize on opportunities in AI servers and laptops next year, gradually increasing demand.

After more than a year of corrections, the DRAM market is finally showing signs of improvement. Major DRAM manufacturers like Samsung and SK Hynix are still reducing production capacity, but their focus is primarily on DDR4 specification DRAM. Industry sources suggest that Samsung, in response to the growing demand for DDR5 DRAM, is set to significantly ramp up DDR5 production in the fourth quarter of this year, anticipating strong order demand next year.

In fact, such as Intel and AMD are planning to introduce new platforms next year that will support DDR5 specification DRAM, indicating a gradual decline in DDR4 demand. Beyond the consumer market, the server market is expected to experience a substantial surge in DDR5 demand, driven by the imminent launch of Intel’s fifth-generation server platform, Emerald Rapids, which fully supports DDR5. As AI server demand gains momentum, DDR5 demand is poised to enter a high-growth phase.

(Source: https://money.udn.com/money/story/5612/7488629 ; Image credit: Micron)

Report to Voice, After the release of the Huawei Mate 60 Pro, various components have begun to experience the long-lost sensation of surging demand, replenishment, and stockpiling. With the launch of the Apple iPhone 15, the once sluggish global consumer electronics market has suddenly come back to life. The current mindset among storage manufacturers is clear: regardless of whether there is a real or perceived shortage, the goal before the year-end is to raise prices until they are no longer incurring losses.

Leading storage giants have gone through a series of price drops, losses, and production reductions, and are now officially entering the “price hike” phase. Samsung, SK Hynix, Micron, and others have already expressed their intention to raise NAND Flash contract prices.

According to TrendForce latest price projection on NAND Flash, in response to persistent softening in demand, Samsung has taken a decisive step: a sweeping 50% production cut from September, with the focus mainly on processes under 128 layers. Other suppliers are also expected to follow suit and increase their production cutbacks in the fourth quarter to accelerate inventory reduction. With this maneuver in play, Q4 NAND Flash average prices are projected to either hold firm or witness a mild surge, possibly in the ballpark of 0~5%.

YMTC now is facing surging demand from both smartphone and module manufacturers. It is reported that the production capacity for the period up to 1H24 has already been fully booked, with PC and server manufacturers sharing the capacity, while module manufacturers may receive a smaller share.

The current NAND Flash market situation is such that trying to negotiate increased supply with NAND Flash manufacturers like Samsung, Micron, and YMTC may yield little new capacity, and accepting higher prices may be inevitable.

The sudden pre-sale launch of the Huawei Mate 60 Pro has undoubtedly acted as a major catalyst for the current smartphone market. Without it, many smartphone supply chain companies believed that the smartphone market wouldn’t recover until the second half of 2024, and the most pessimistic among them even doubted if it would improve by 2024. The release of the Huawei Mate 60 Pro and the Apple iPhone 15 has injected a long-awaited warmth into the global smartphone market, reinvigorating the entire smartphone component supply chain.

In recent times, the top-tier iPhone 15 Pro Max from Apple’s iPhone 15 series is expected to be available only in November, which some interpret as a sign of strong demand. However, it is more likely due to production bottlenecks, particularly related to technologies like CIS, which have resulted in limited shipments of the iPhone 15 Pro Max. Overall, the estimated shipment volume for the iPhone 15 series may still reach up to 80 million units.

Is this resurgence in smartphone demand a lasting trend with increased consumer willingness to upgrade, or is it a temporary phenomenon? Optimists and conservatives hold differing views, but what is certain is that the global smartphone shipment volume has entered a mature phase, with limited room for significant growth driven solely by new features. However, the storage capacity in each smartphone continues to increase, providing substantial opportunities for existing supply chain manufacturers.

While new opportunities like automotive and AI have emerged, there is still no demand in any new field that can entirely replace the massive smartphone market. Therefore, the consensus within the global tech industry is that for the economy to rebound, the consumer electronics sector, particularly smartphones, is indispensable at this stage. AI and electric vehicles alone cannot take the place of smartphones. (Image credit: YMTC)

(Source: https://mp.weixin.qq.com/s/cb0kRUpWU6MElLNh9CR9eA)

According to the Korea Economic Daily. Samsung Electronics’ HBM3 and packaging services have passed AMD’s quality tests. The upcoming Instinct MI300 series AI chips from AMD are planned to incorporate Samsung’s HBM3 and packaging services. These chips, which combine central processing units (CPUs), graphics processing units (GPUs), and HBM3, are expected to be released in the fourth quarter of this year.

Samsung is noted as the sole provider capable of offering advanced packaging solutions and HBM products simultaneously. Originally considering TSMC’s advanced packaging services, AMD had to alter its plans due to capacity constraints.

The surge in demand for high-performance GPUs within the AI landscape benefits not only GPU manufacturers like NVIDIA and AMD, but also propels the development of HBM and advanced packaging.

In the backdrop of the AI trend, AIGC model training and inference require the deployment of AI servers. These servers typically require mid-to-high-end GPUs, with HBM penetration nearing 100% among these GPUs.

Presently, Samsung, SK Hynix, and Micron are the primary HBM manufacturers. According to the latest research by TrendForce, driven by the expansion efforts of these original manufacturers, the estimated annual growth rate of HBM supply in 2024 is projected to reach 105%.

In terms of competitive dynamics, SK Hynix leads with its HBM3 products, serving as the primary supplier for NVIDIA’s Server GPUs. Samsung, on the other hand, focuses on fulfilling orders from other cloud service providers. With added orders from customers, the gap in market share between Samsung and SK Hynix is expected to narrow significantly this year. The estimated HBM market share for both companies is about 95% for 2023 to 2024. However, variations in customer composition might lead to sequential variations in bit shipments.

In the realm of advanced packaging capacity, TSMC’s CoWoS packaging technology dominates as the main choice for AI server chip suppliers. Amidst strong demand for high-end AI chips and HBM, TrendForce estimates that TSMC’s CoWoS monthly capacity could reach 12K by the end of 2023.

With strong demand driven by NVIDIA’s A100 and H100 AI Server requirements, demand for CoWoS capacity is expected to rise by nearly 50% compared to the beginning of the year. Coupled with the growth in high-end AI chip demand from companies like AMD and Google, the latter half of the year could experience tighter CoWoS capacity. This robust demand is expected to continue into 2024, potentially leading to a 30-40% increase in advanced packaging capacity, contingent on equipment readiness.

(Photo credit: Samsung)