According to sources cited by the Financial Times, South Korean chip manufacturer SK Hynix is reportedly planning to establish a packaging facility in Indiana, USA. This move is expected to significantly advance the US government's efforts to bring more artificial intelligence (AI) chip supply cha...

From the current landscape of publicly available DRAM technologies, the industry is expected to perceive 3D DRAM as one of the solutions to the challenges faced by DRAM technology, marking it as a pivotal direction for the future memory market. Is 3D DRAM similar to 3D NAND? How will the industry...

Another breakthrough has emerged in flash memory layer technology! A recent report cited by tom’s Hardware has suggested that at the upcoming International Solid-State Circuits Conference (ISSCC) in February of this year, Samsung Electronics will unveil the next-generation V9 QLC NAND solution, pu...

Japanese telecommunications operator NTT is reportedly collaborating with American chipmaker Intel and other semiconductor manufacturers to research large-scale production of next-generation semiconductor technology, which involves significantly reducing power consumption using optical technology. ...

Amid the AI trend, the significance of high-value-added DRAM represented by HBM continues to grow. HBM (High Bandwidth Memory) is a type of graphics DDR memory that boasts advantages such as high bandwidth, high capacity, low latency, and low power consumption compared to traditional DRAM chips. ...