SK Hynix


2023-08-23

[News] TSMC Faces Capacity Shortage, Samsung May Provide Advanced Packaging and HBM Services to AMD

According to the Korea Economic Daily. Samsung Electronics' HBM3 and packaging services have passed AMD's quality tests. The upcoming Instinct MI300 series AI chips from AMD are planned to incorporate Samsung's HBM3 and packaging services. These chips, which combine central processing units (CPUs), ...

2023-08-09

[News] SK Hynix Sets Milestone with 321-Layer NAND Flash Demonstration

SK Hynix, a semiconductor leader, announced a significant breakthrough in NAND flash technology on August 9 at the Flash Memory Summit in California. They introduced a pioneering 321-layer 1Tb TLC 4D NAND flash memory, marking a notable advancement in NAND capabilities. As the first company in th...

2023-06-14

Sporadic Uptick Observed in Lower-Priced DDR4 Memory Modules

DRAM Spot Market Regarding recent developments in the spot market, there have been sporadic price upticks for low-priced DDR4 products. Meanwhile, prices of DDR5 products have kept falling due to the plentiful chip supply. Unlike the contract market, the spot market has been relatively unaffected b...

2023-05-18

YMTC Raises NAND Flash Prices with the Expect of Wafer Prices to Rebound in 2H23

YMTC has officially notified a 3~5% price increase for NAND Flash in mid-May. However, the initial impact of the price hike is expected to be felt in the enterprise market, and it may take some time to reflect in the consumer spot market. The semiconductor industry is in the midst of a correction...

2023-05-10

Memory Spot Prices were volatile this week, with Q2’s Average Price Decline worsening

TrendForce’s latest research indicates that, as production cuts to DRAM and NAND Flash have not kept pace with weakening demand, the ASP of some products is expected to decline further in 2Q23. DRAM prices are projected to fall 13~18%; NAND Flash is expected to fall between 8~13%. On the other ...

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