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Recently, U.S.-based memory giant Micron Technology announced the groundbreaking of a new HBM (High Bandwidth Memory) advanced packaging facility in Singapore. This facility will be the first of its kind in Singapore and is scheduled to begin operations in 2026. Starting in 2027, Micron’s advan...
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According to Chosun Biz, Samsung Electronics has reportedly decided to cut NAND flash production at its Xi’an plant in China, its largest manufacturing base for the memory chips. The move appears to be a strategic effort to protect profitability as a global NAND oversupply persists, leading to a p...
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According to The Korea Economic Daily, cited by The Liberty Times, South Korea’s semiconductor sector is grappling with a severe talent drain as Chinese companies like ChangXin Memory Technologies (CXMT) aggressively recruit engineers from major players Samsung Electronics and SK Hynix. Notably, 3...
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The meeting between AI accelerator giant NVIDIA and HBM leader SK hynix may be one of the most anticipated events at CES 2025. Following the talks with NVIDIA CEO Jensen Huang, SK Group Chairman Chey Tae-won confirmed the company’s positive advancements in next-gen HBMs, saying that its chip devel...
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Is the winter really coming in the memory market just as 2025 kick starts? In addition to rumors of major players scaling down traditional DRAM production, a ZDNet report suggests that Samsung and SK hynix have recently cut back on legacy NAND production and begun upgrading underutilized old facilit...