smartphone


2024-05-30

[News] MediaTek Announces 4nm Dimensity 7300 Series Chips, Supporting Foldable Devices

On May 30, MediaTek unveiled the Dimensity 7300 series mobile chips, including the Dimensity 7300 and Dimensity 7300X, both utilizing TSMC’s highly efficient 4nm process. The Dimensity 7300 offers exceptional energy efficiency and performance, meeting the high demands for multitasking, imaging, gaming, and AI computing in terminal devices. The Dimensity 7300X supports dual-screen displays, making it suitable for foldable devices.

The Dimensity 7300 series features an octa-core CPU with 4X Arm Cortex-A78 cores operating at 2.5GHz paired with four Cortex-A55 cores. Compared to the Dimensity 7050, the advanced 4nm Cortex-A78 cores in the Dimensity 7300 can achieve up to 25% power savings at the same performance level.

The Dimensity 7300 is equipped with a 12-bit HDR-ISP image processor, Imagiq 950, which supports up to a 200MP main camera, enabling smartphone users to capture images with outstanding color and detail. The Dimensity 7300 combines a new hardware engine that provides precise noise reduction (MCNR), hardware face detection (HWFD), and video HDR capabilities, allowing users to capture clear images in various lighting conditions.

“The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business. “Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support.”

Compared to the Dimensity 7050, the Dimensity 7300 offers a 1.3 times improvement in live focus photo performance and a 1.5 times improvement in photo remastering. Additionally, the dynamic range for 4K HDR video recording has been enhanced by 50% compared to similar products, delivering richer image details. The Dimensity 7300 integrates the AI processor APU 655, which delivers performance that is twice that of the Dimensity 7050.

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(Photo credit: MediaTek)

Please note that this article cites information from MediaTek.

2024-05-30

[News] Samsung Union Launches First-ever Strike, Potentially Impacting Global Semiconductor Supply Chain

The global semiconductor supply chain may face disruption as the Samsung Electronics union announces its first-ever company strike on June 7. According to a report from BBC, approximately 28,000 union members, accounting for more than 20% of Samsung’s total workforce, are expected to participate. The union accuses the company of long-term neglect of employees’ and the union’s demands.

Samsung Electronics is a major subsidiary of the Samsung Group, primarily responsible for the design, production, and assembly of consumer electronics, semiconductors, and communication devices. In the wafer foundry sector, Samsung is a key competitor to TSMC, with the two giants vying for leadership in advanced manufacturing processes.

In addition to its impact on the foundry industry, Samsung is also one of the world’s largest smartphone manufacturers and a leader in memory production. It is among the few global companies capable of integrating advanced memory chips into generative artificial intelligence technology.

Samsung is now facing the impact of a strike, which could further affect the global semiconductor supply chain.

However, as per industry sources cited by TechNews, it’s suggested that the strike by the Samsung union is unlikely to impact plant operations significantly.

As the union announces the strike, there has also been a significant shake-up in the chip division’s leadership. Young Hyun Jun has been appointed as the new head of the Device Solutions (DS) division, responsible for leading the company’s semiconductor business.

Per a report from Reuters, a source has noted that since Samsung’s personnel changes typically occur at the beginning of the year, it is unusual to replace a high-ranking executive like this in the middle of the year.

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(Photo credit: Samsung)

Please note that this article cites information from BBCTechNews and Reuters.

2024-02-05

[News] The Next Battlefield for High-End Flagship Phones? Huawei Rumored to Unveil Z-Fold Phone This Year

“Foldable Phones” have emerged as the new epitome of high-end flagship smartphones. However, whether it’s in the form of vertical or horizontal folding, it may no longer meet the needs of some users.

Recently, industry sources cited by TechNews has suggested that Chinese smartphone brand Huawei is planning to launch a triple-fold foldable phone this year. This move is expected to make smartphones unfolded more akin to the size and functionality of tablet computers.

As for the folding form, it might be in a Z-shaped (or S-shaped) manner. The screen size after folding would be similar to that of a regular smartphone, approximately 6.4 inches. It is rumored that Huawei’s Z-fold phone’s panel supplier could be BOE.

However, the design of the triple-fold phone may not be limited to just the Z-fold type; it could also be designed in a G-fold manner.

What is the G-fold type? It means both hinges fold inward. Nonetheless, such a design would necessitate adding a cover screen, which would increase the overall weight and thickness. Additionally, to cover the folded panel, the folding radius of the other side’s hinge must be enlarged.

As for the Z-fold (or S-fold) design, while it allows for the use of the outer folded panel as a cover screen, thus saving weight, the simultaneous presence of both inward and outward folding poses significant challenges to the panel’s layer stacking design and the mechanism’s design.

However, some people may wonder, “Are foldable phones really selling well?” In fact, according to TrendForce’s data,  for the shipment numbers last year, the existing shipment volume of foldable phones still falls short of expectations, reaching only 15.7 million units, failing to surpass the 16 million mark.

The sales performance of the leading brand in foldable phones, Samsung Electronics, was also not as good as expected, remaining at around 10.5 million units. The sales situation of other Chinese brands also did not meet expectations.

While foldable phones have indeed become the new symbol of high-end flagship smartphones, the fact is that the design patterns have become quite fixed. For consumers who are always looking for something new, these phones have lost their novelty and breakthrough points.

Therefore, brands have begun to contemplate the future of foldable phones with new designs and are considering abandoning certain design patterns to achieve better profitability.

For instance, OPPO and vivo are expected to abandon upright foldable phone models within this year, opting to retain only the left-right folding models (Fold).

The main reason behind this decision is that the pricing of upright foldable phones is lower, and although there might be a chance of higher shipment volumes compared to the Fold models, the profit margins are not significant.

Now that the demand for foldable phones has started to plateau, it is anticipated that the demand for foldable phones this year will only reach 17.7 million units, a 12.3% year-on-year increase.

In the face of sluggish end-user demand, why are smartphone brands still considering launching new types of foldable phones? This relates to the notion of “technological showcase.” Huawei’s triple-fold phone design takes into account technological capabilities, yield rates, and other factors.

Initially, the scale may not be too large, but the technological demonstration aspect remains potent. Huawei is anticipated to position itself as a technological leader, exerting pressure on other smartphone brands to a certain extent.

However, brands are not only contemplating “folding” smartphone designs. Some brands have also begun considering rollable and pull-up designs, aiming to inject new vitality into the smartphone market.

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(Photo credit: Huawei)

Please note that this article cites information from TechNews.

2024-01-05

[News] Huawei Issues Rush Orders for Crucial Components, Focusing on CIS for Foldable Phones

In a strong push for foldable smartphones, reportedly, Huawei has issued rush orders to its supply chain lately. The shipment target for foldable smartphones this year is set at ten million units, marking a nearly threefold increase from the 2.6 million units shipped last year.

Previous rumors suggested that Huawei was considering lowering its foldable smartphone shipment targets for this year. However, the industry sources from related supply chain emphasizes that not only did Huawei refrain from reducing orders, but it significantly increased them.

According to Economic Daily News cited from supply chain sources, Huawei has set very ambitious goals for foldable smartphone shipments this year, aiming to increase from last year’s 2.6 million units to a range of 7 to 10 million units. This represents a nearly threefold increase, requiring additional support from various components.

Among them, the critical mobile phone component CIS, due to a rebound from the market downturn, has seen prices starting to surge. Main CIS supplier, Samsung, has raised prices by 25% to 30% this quarter.

To avoid the risk of escalating prices, CIS has become Huawei’s top priority for stocking up, primarily supplied by the Chinese CIS supplier, OmniVision. The substantial increase in overall shipment targets for foldable smartphone has driven a several-fold growth in CIS stockpiles.

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(Photo credit: Huawei)

Please note that this article cites information from Economic Daily News

2023-12-31

[Tech Recap and Glimpse 5-4] Can Huawei Successfully Capture Apple’s High-End Smartphone Market?

In 2019, the U.S. Commerce Department blacklisted Huawei and over 70 of its subsidiaries, restricting China’s advancement in advanced chip development.

However, in August 2023, Huawei unexpectedly launched its new flagship smartphone, the Mate 60 Pro, featuring its self-developed 5G chip, hinting at Huawei’s breakthrough in the U.S. 5G chip restriction.

The release of this new smartphone swiftly dominated the high-end smartphone market in China, with Apple being the primary target. As Huawei plans to expand the market share of its high-end flagship series in 2024, targeting the domestic market in China, the product is poised for direct competition with Apple.

The performance of Apple’s smartphones in the Chinese market next year will be a focal point of industry attention.

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(Photo credit: Huawei)

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