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Rumors have been circulating regarding Samsung’s 3nm yield recently. The latest market speculation on June 25th alleged that Samsung’s foundry plant encountered a defect impacting 2,500 lots in the 3nm second-generation process, reportedly leading to a loss of 1 trillion won (USD 720 million), according to the latest report by the Chosun Daily.
On June 26th, the semiconductor giant denied the rumors of a major defect in the production of semiconductor wafers at its foundry division in South Korea. Market speculations emerged earlier, suggesting that all the affected wafers, which equal to 2,500 lots, had to be discarded, the report noted. The volume corresponds to roughly 65,000 12-inch equivalent wafers per month.
According to the Chosun Daily, Samsung claimed that the rumor of “discarding them (the affected wafers) all” circulating in the stock market are unfounded. The current status of the products from the affected production line is still under evaluation, the report said.
Citing industry insiders familiar with the matter, the Chosun Daily noted that the reported figures might be exaggerated, pointing out that Samsung’s 3nm production capacity is less than 60,000 wafers per month. Furthermore, there are numerous inspection processes in place throughout the production line, indicating that such a large-scale defect may be improbable.
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(Photo credit: Samsung)
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Last year, Qualcomm entered the PC market, sparking an AI PC frenzy in collaboration with Microsoft Copilot+. According to Qualcomm CEO Cristiano Amon, beyond mobile devices, PCs, and automotive applications, Qualcomm is now focusing on data centers. In the long term, these products will eventually adopt Qualcomm’s in-house developed Nuvia architecture.
Amon pointed out that as PCs enter a new cycle and AI engines bring new experiences, just as mobile phones require slim designs but must not overheat or become too bulky, Qualcomm has always been focused on technological innovation rather than just improving power consumption. While traditional PC leaders may emphasize TOPS (trillions of operations per second), energy and efficiency are also crucial.
Amon stressed the importance of maintaining battery life and integrating functionalities beyond CPU and GPU, which he believes will be key to defining leadership in the PC market. He also joked that if you use an X86 computer, it would run out of battery quickly, but with a new computer (AI PC) next year, it would last a long time without draining power.
Amon noted that Qualcomm’s Snapdragon X Elite and Snapdragon X Plus have been developed with superior NPU performance and battery life. Moreover, Snapdragon X Elite is just the first generation, which focuses more on performance supremacy, while the upcoming generations may put more emphasis on computational power, and integrating these into chip design.
Currently, more than 20 AI PCs equipped with Snapdragon X Elite and Snapdragon X Plus have been launched, including models from 7 OEMs, such Acer, Asus, Dell, HP, and others.
Amon believed that the market penetration rate will continue to increase next year. He sees AI PCs as a new opportunity, suggesting that it may take some time for them to be widely adopted when a new version of Windows for PC market emerges. However, considering the end of Windows 10 support, users can transition to new models with Copilot+, which he believes will be adopted much faster.
Amon pointed out that NPUs have already demonstrated their advantages in the PC and automotive chip industries, and these capabilities can be extended to data centers or other technologies.
He then highlighted data centers as a significant opportunity for transition to Arm architecture and expressed belief in increased opportunities for edge computing in the future. Amon also mentioned the adoption of Nuvia architecture in smartphones, data centers, and automotive industries. Additionally, he disclosed plans to launch mobile products featuring Microsoft processors at the October Snapdragon Annual Summit.
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(Photo credit: Qualcomm)