SoIC


2024-08-05

[News] Innolux’s 4th Plant in Tainan Reportedly to be Secured by TSMC

A previous report from Economic Daily News once reported that, Innolux is set to sell its 4th Plant in Tainan (5.5-generation LCD panel plant), which was closed in 2023. Moreover, the report has cited rumors in the market, claiming that both Micron and TSMC have been actively exploring the acquisi...

2024-07-03

[News] TSMC SoIC Expected to Gain Major Customer with Apple Ramp-Up in 2025

According to a report from Economic Daily News, TSMC's advanced packaging platform SoIC is said to have secured another heavyweight customer, with Apple expected to adopt the technology in 2025. If confirmed, Apple will join AMD as a major client expanding its use of TSMC's SoIC . TSMC has categ...

2024-05-06

[News] TSMC’s Advanced Packaging Capacity Fully Booked by NVIDIA and AMD Through Next Year

With the flourishing of AI applications, two major AI giants, NVIDIA and AMD, are fully committed to the high-performance computing (HPC) market. It's reported by the Economic Daily News that they have secured TSMC's advanced packaging capacity for CoWoS and SoIC packaging through this year and the ...

2024-05-02

[News] TSMC Advanced Packaging Crucial for AI Computing Power

The demand for AI computing power is skyrocketing, with advanced packaging capacity becoming key. As per a report from Commercial Times citing industry sources, it has pointed out that TSMC is focusing on the growth potential of advanced packaging. Southern Taiwan Science Park, Central Taiwan Sci...

2024-04-17

[News] Apple Not Adopting TSMC 2nm for iPhone 17? A19 Pro Chip Rumored to Use N3P Process

Apple currently uses TSMC's 3-nanometer process for multiple chipsets. According to a report from wccftech, the iPhone 17 chipset will not adopt the 2-nanometer process. Instead, the A19 Pro chip, expected in 2025, is reportedly maintaining the 3-nanometer technology. The same report suggests tha...

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