Amid NVIDIA's leadership in the AI wave, demand for CoWoS (Chip-on-Wafer-on-Substrate) has tripled, driving TSMC to aggressively expand CoWoS capacity, with a corresponding surge in demand for System-in-Integrated-Circuit (SoIC) solutions. According to a report from MoneyDJ citing industry source...

With AI demand exploding across the board, TSMC initiated a major expansion plan for CoWoS in 2023. According to MoneyDJ citing sources, TSMC reportedly initiated a new wave of orders to Taiwan-based equipment manufacturers this month. Delivery is expected in the fourth quarter of this year. Ther...

In the surge of AI advancements, a CoWoS expansion wave is rapidly underway, with TSMC showcasing ongoing ambitions in advanced packaging. According to MoneyDJ, recent industry reports suggest that TSMC is revising upward its capacity plans for SoIC (System-on-Integrated-Chips). By the end of thi...

Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts for these products assigned to TSMC and UMC, according to TrendForce’s latest investigations. While the company is planning to kick off mass production of Core i3 CPUs at TSMC’s 5nm node in 2H...