The U.S. Department of Commerce has initiated the "National Advanced Packaging Manufacturing Program (NAPMP) ," with materials and substrates being the first subsidized areas. Due to the close collaboration between IC testing and IC substrates, it is not ruled out that the IC substrate industry coul...

TSMC's trillion-dollar investment plan for a 1nm fab is reportedly set to be established in the science park in Taibao City, Chiayi County, Taiwan. This follows TSMC's recent announcement of the construction of its third 2nm fab in Kaohsiung, marking yet another strategic choice for advanced process...

TSMC's 2nm fab, strategically positioned between the Hsinchu Science Park and the Nanzih Technology Industrial Park in Kaohsiung Science Park, is rapidly taking shape. According to Liberty Times Net, reports from the supply chain suggest that up to five fabs could be constructed in the Nanzih. Th...

According to ChinaTimes’s report, following Taiwan's implementation of strict control on 22 core key technologies, several Taiwanese lawmakers are urging the country's Ministry of Economic Affairs to also consider "mild control" for the export of mature semiconductor process equipment and industry...

In an announcement on December 5th, Taiwan’s National Science and Technology Council(NSTC) has designated 22 technologies, such as IC manufacturing and heterogeneous integration packaging, as national core key technologies. This inaugural list prioritizes technologies with leading advantages and i...