As the demand for AI chips surges, orders for thermal compression (TC) bonders, which play a critical role in HBM (high-bandwidth memory) manufacturing, are also heating up.

To further gain market momentum, South Korean chip packaging equipment manufacturer Hanmi Semiconductor plans to launch 2.5D big die TC bonder models in the second half of 2024, while increasing its annual sales target for this year to 650 billion won (USD 471 million), according to the latest report by the Korea Economic Daily.

Citing Kwak Dong-shin, vice chairman and CEO of Hanmi Semiconductor, the report notes that the company eyes strong revenue growth in the next two years, projecting 1.2 trillion won (USD 870 million) in sales for 2025, and 2 trillion won (USD 1.45 billion) for 2026.

TC bonders play a pivotal role in HBM production by employing thermal compression to bond and stack chips on processed wafers, thereby significantly influencing HBM yield. According to the report, Hanmi plans to introduce several upgraded models in the next two years, including 2.5D big die TC bonders in the second half of this year, mild hybrid bonders in the latter half of 2025, and hybrid bonders in 2026.

Memory giants have developed their own ecosystems to secure TC bonders’ supply. The report notes that Hanmi has been providing its TC bonders to SK hynix, while the latter is a major HBM supplier to Nvidia. In addition, the company also entered into a 22.6 billion won agreement with Micron in April.

Whether in the near future, Hanmi Semicodutor would be able to finalize similar contracts with Samsung, another memory heavyweight, remains to be seen. For now, Samsung sources its equipment from Japan’s Toray and Sinkawa, as well as its subsidiary SEMES.

Hanmi Semiconductor produces TC bonders at its six factories located in Incheon, where its headquarters are situated. The report indicates that it aims to increase the capacity of its newest, the sixth factory from 264 units of TC bonders annually this year to 420 units next year, which makes it the largest annual capacity for TC bonder producers worldwide.

Read more

• [News] Rising HBM Production by Samsung and SK Hynix Energizes Korea’s TC Bonder Industry
• [News] ASMPT Reportedly Provided Demo TC Bonder to Micron for HBM Production

(Photo credit: Hanmi Semicondutor)

Driven by memory giants ramping up high-bandwidth memory (HBM) production, according to a report from Korean media outlet TheElec, ASMPT, a back-end equipment maker, has supplied a demo thermal compression (TC) bonder for Micron’s HBM production.

TC bonders play a pivotal role in HBM production by employing thermal compression to bond and stack chips on processed wafers, thereby significantly influencing HBM yield.

ASMPT is reportedly collaborating with the US memory giant to co-develop a TC bonder for use in HBM4 production. Notably, ASMPT has supplied TC bonders to SK Hynix as well and plans to deliver more units later in the year.

Micron is also procuring TC bonders from Shinkawa and Hanmi Semiconductor for the production of HBM3e. However, as per the same report citing sources, Shinkawa has its handful in supplying the bonders to its largest customer, so Micron added Hanmi Semiconductor as a secondary supplier.

In addition to Micron, Samsung Electronics and SK Hynix have developed distinct supply chains for TC bonders. Samsung sources its equipment from Japan’s Toray and Sinkawa, as well as its subsidiary SEMES. In contrast, SK Hynix relies on Singapore’s ASMPT, HANMI Semiconductor, and Hanhwa Precision Machinery.

According to industry sources cited by The Chosun Daily, TC bonder orders driven by memory giants have been strong, as Samsung Electronics’ subsidiary SEMES has delivered nearly 100 TC bonders over the past year. Meanwhile, SK Hynix has inked a approximately $107.98 million contract with HANMI Semiconductor, which commands a 65% share of the TC bonder market.

Regarding the latest developments in HBM, TrendForce indicates that HBM3e will become the market mainstream this year, with shipments concentrated in the second half of the year. Currently, SK hynix remains the primary supplier, along with Micron, both utilizing 1beta nm processes and already shipping to NVIDIA.

According to TrendForce predictions, the annual growth rate of HBM demand will approach 200% in 2024 and is expected to double in 2025.

Read more

• [News] Rising HBM Production by Samsung and SK Hynix Energizes Korea’s TC Bonder Industry
• [News] Micron’s HBM Expansion at Full Throttle: Rumored to Expand in US, Malaysia Also an Option

(Photo credit: Micron)