According to a report from Ijiwei, a China-based media, industry insiders have revealed that Taiwanese display driver IC (DDI) suppliers are considering shifting their chip manufacturing to China due to cost considerations, as the prices offered by chip foundries there are significantly lower than those in Taiwan.

Almost all DDI suppliers are feeling substantial pressure to reduce the prices of display driver chips in the latter half of 2023. Industry sources state that while the touch and display driver integration (TDDI) chips for smartphone screens have nearly reached cost parity, the prolonged slump in the smartphone market has led display panel customers to shift the pressure upstream along the supply chain.

The downward pricing pressure on display driver chips isn’t confined to the smartphone sector alone. Medium and large panel customers in segments like TVs and automotive displays are also requesting more substantial discounts from DDI manufacturers. However, the pressure from these sectors is somewhat less pronounced than that from the smartphone sector.

(Photo credit: Transsion)

As the pandemic has eased, the global automotive market is picking up momentum, and it is estimated that the global shipments of automotive panels will exceed 200 million units in 2023. With the continuous demand for size enlargement and specification improvement in automotive panels, the adoption of TDDI architecture is becoming more prevalent, and it is expected that TDDI will gradually become the mainstream for automotive panels.

On the other hand, AMOLED panels have started to have opportunities for adoption in emerging electric vehicles and some high-end car models. However, their adoption has been slow due to potential issues with reliability, lifespan, and brightness. Currently, the overall penetration rate for AMOLED panels in the automotive sector is estimated to reach 6% by 2026.

Can Panel Manufacturers Replace Traditional Tier 1 Players and Directly Serve Automakers?

As traditional internal combustion engine vehicles transition to electric vehicles and the level of in-car electronics continues to rise, coupled with the development of autonomous driving technologies, the demand for automotive displays is constantly expanding. The integration of digital display panels with touch functionality is gradually becoming mainstream, and panel sizes are increasing, moving towards more integrated designs. Specifications such as resolution, wide viewing angles, and high refresh rates, as well as unique designs, are becoming focal points. Currently, display panel specifications are moving towards LTPS LCD panels, which offer larger sizes, superior display performance, and better energy efficiency.

Looking at the market conditions, after the outbreak of the pandemic in 2020, the demand for automotive panels declined, but it gradually recovered in 2021 and 2022. However, there is still an oversupply situation, and it is estimated that there will be a slight growth of 5.1% to reach 205 million units in 2023. In terms of shipment scale, China’s panel shipments maintain the best position with a share of over 40%, while Japanese panel manufacturers have been squeezed by Chinese counterparts, reducing their share to about 20%. Taiwan’s panel manufacturers account for approximately 21%, and Korean panel manufacturers represent 8%.

The traditional shipment model involves Tier 1 players contracting with car manufacturers for related validation, assembly, and supply chain management roles, and then subcontracting Tier 2 panel suppliers. With the transformation of the automotive industry and the semiconductor component shortages in the past few years, as well as the increased requirements for interior design in vehicles, car manufacturers are starting to seek better control over the supply chain. As a result, panel manufacturers may replace Tier 1 players and directly supply to automakers, and Tier 1 suppliers will face competition from panel manufacturers.

The Automotive TDDI Architecture Has Cost Advantages

In the early days, LCD automotive panels mainly used external touch solutions, with car-use DDI and independent touch ICs on the IC architecture. However, as panel sizes increased, the number of ICs used also increased, leading to higher costs. Therefore, the TDDI architecture became a new development direction.

TDDI is commonly used for panels up to 30 inches in size. A single TDDI solution can be used for 20-inch panels, while for 20-30 inch panels, a TDDI-cascade solution with approximately 2-3 TDDI-cascade architectures is often used. Panels larger than 30 inches use the LTDI (Local TDDI) structure.

New Display Technology Awaits Automotive Certification; Significant Growth Expected after 2025

AMOLED is mostly used in high-end car models or stylish new electric vehicles, but its rapid development is hindered by limitations in brightness, panel lifespan, and reliability. In comparison, LCDs with MiniLED BLU architecture offer similar display performance to AMOLED but at a more affordable price and with better safety, and they are expected to compete with AMOLED in the market.

For more information on this report or market data from TrendForce’s Department of Display Research, please click here, or email Ms. Grace Li from the Sales Department at graceli@trendforce.com

The latest study by TrendForce shows that demand for large-size and mobile driver ICs will steadily grow as various applications recover. However, the speed of capacity supply adjustment and competition among different technologies will remain the key focus in the next few quarters.

Another thing worth noting is that the US chip ban has led to a trend of independent development between Chinese and non-Chinese supply chains. While this may increase production time and cost, it also presents opportunities for individual Chinese domestic suppliers and Taiwanese wafer foundries to acquire fresh orders.

Observations by TrendForce on each sector of driver ICs are summarized below-

• Large-size panel driver ICs: demand is expected to recover gradually and stabilize prices, but suppliers are cautious about inventory, which could lead to a supply shortage if demand surges too quickly.
• TDDI for mobile devices: prices and inventory have reached a low point, with a small rebound expected. In the long run, AMOLED panels are expected to dominate, so IC suppliers will need to explore new applications for medium-sized panels.
• AMOLED driver ICs: UMC’s 28nm high-voltage process is producing AMOLED driver ICs. If Apple shifts all 40nm AMOLED driver IC production to 28nm, TSMC’s 28nm capacity availability will be crucial to the market’s supply-demand balance.
• RAM-Less AMOLED driver ICs: RAM-Less AMOLED driver ICs with Chinese flexible AMOLED panels are gradually taking shape due to China’s domestic policy. However, the rapid price drop of Full-Ram AMOLED has caused brands to hesitate on adopting Ram-Less AMOLED.

Given the forecasted recovery of the smartphone market and the corresponding rise in TDDI IC demand throughout this year, total smartphone TDDI IC shipment for 2021 is expected to reach 760 million units, according to TrendForce’s latest investigations. Tablet TDDI IC shipment for 2021, on the other hand, is expected to reach 95 million units.

TrendForce indicates that the overall demand for consumer electronics and IT products has been gradually intensifying since the COVID-19 pandemic began to slow down in 2H20. At the same time, smartphone manufacturers restocked their component inventories, while Huawei was sanctioned by the U.S. Department of Commerce. These events marked an upturn in demand for smartphone components, including IC products. However, although foundries ramped up their capacity utilization rates in response to soaring end-product demand, semiconductor component supply has been lagging behind the rising demand.

Case in point, TDDI IC prices have been increasing due to the component’s tightening supply. As foundries’ production capacities at their 12-inch fabs’ 80/90nm nodes are unable to meet the global demand for TDDI ICs, IC design companies have been stepping up the pace to transition the manufacturing process of their higher-end TDDI IC products from the 80/90nm nodes to the 55nm node instead. Smartphone and tablet manufacturers, on the other hand, have expanded their procurement activities for TDDI ICs owing to a forecasted shortage of these components. These factors propelled smartphone TDDI IC shipment for 2020 to 700 million units, a 25% increase YoY.

Tablet TDDI IC shipment for 2021 is projected to reach 95 million units as the tablet market becomes the next battleground for IC design companies

Smartphone manufacturers have been ramping up TDDI IC adoption in light of smartphone TDDI ICs’ increasing maturity. In addition, as 8-inch capacities become fully loaded across the foundry industry, IC design companies are accelerating the transition of traditional discrete DDIC architecture to TDDI IC, which is primarily manufactured with 12-inch wafers. This transition is expected to result in even higher demand for foundry capacities. As previously mentioned, wafer capacities at the 80/90nm nodes have been in severe shortage. Therefore, to mitigate the risk of tight wafer supply in 2020, IC design companies are now not only transitioning their TDDI IC manufacturing process towards the 55nm node, but also looking to secure a stable supply of wafer capacities by outsourcing their manufacturing operations across a diverse number of foundries. As smartphone demand rises going forward, smartphone TDDI IC shipment for 2021 is expected to reach 760 million units, an 8.6% increase YoY.

Likewise, IC design companies have also turned their attention to the budding tablet market and started releasing TDDI ICs for tablets. IC design companies are primarily interested in developing TDDI ICs for tablets for two reasons: First, a mid-range or high-end tablet contains double the number of TDDI ICs per unit compared to smartphones. Secondly, most of these tablets feature active stylus compatibility, which means the ASP for their display ICs is relatively high. For the past two years, Huawei in particular has been ambitious in cultivating its tablet market and developing TDDI ICs. However, other IC design companies are now following suit and participating in this market as IC design technologies become more mature, and more tablet manufacturers become proactive in adopting TDDI ICs for tablet use. Tablet TDDI IC shipment for 2020 is estimated at 65 million units, whereas this number is projected to reach 95 million for 2021, an impressive 46.2% increase YoY.

For more information on reports and market data from TrendForce’s Department of Display Research, please click here, or email Ms. Vivie Liu from the Sales Department at vivieliu@trendforce.com