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    • thermal compression

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    2024-07-09

    [News] Hanmi Semiconductor to Launch 2.5D TC Bonders, Eyeing Strong Growth in 2024-26

    Semiconductors

    As the demand for AI chips surges, orders for thermal compression (TC) bonders, which play a critical role in HBM (high-bandwidth memory) manufacturing, are also heating up. To further gain market momentum, South Korean chip packaging equipment manufacturer Hanmi Semiconductor plans to launch 2.5...

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