Although current semiconductor process technologies have evolved to the 3nm and 5nm nodes, SoC (system on a chip) architecture has yet to be manufactured at these nodes, as memory and RF front-end chiplets are yet to reach sufficient advancements in transistor gate length and data transmission performance. Fortunately, EDA companies are now attempting to leverage heterogeneous integration packaging technologies to link the upstream and downstream semiconductor supply chains as well as various IP cores. Thanks to this effort, advanced packaging technologies, including 2.5D/3D IC and SiP, will likely continue to push the limits of Moore’s Law.

While SoC development has encountered bottlenecks, EDA tools are the key to heterogeneous integration packaging

As semiconductor process technologies continue to evolve, the gate length of transistors have also progressed from μm (micrometer) nodes to nm (nanometer) nodes. However, the more advanced process technologies are not suited for manufacturing all semiconductor components, meaning the development of SoC architectures has been limited as a result. For instance, due to physical limitations, memory products such as DRAM and SRAM are mostly manufactured at the 16nm node at the moment. In addition, RF front-end chiplets, such as modems, PA (power amplifiers), and LNA (low noise amplifiers) are also primarily manufactured at the 16nm node or other μm nodes in consideration of their required stability with respect to signal reception/transmission.

On the whole, the aforementioned memory, and other semiconductor components cannot be easily manufactured with the same process technologies as those used for high-end processors (which are manufactured at the 5nm and 3nm nodes, among others). Hence, as the current crop of SoCs is not yet manufactured with advanced processes, EDA companies including Cadence, Synopsys, and Siemens (formerly Mentor) have released their own heterogeneous integration packaging technologies, such as 2.5D/3D IC and SiP (system in package), in order to address the demand for high-end AI, SoC architecture, HPC (high performance computing), and optical communication applications.

EDA companies drive forward heterogeneous integration packaging as core packaging architecture and integrate upstream/downstream supply chain

Although the current crop of high-end semiconductor process technologies is still incapable of integrating such components as memory, RF front-end, and processors through an SoC architecture, as EDA companies continue to adopt heterogeneous integration packaging technology, advanced packaging technologies, including 2.5D/3D IC and SiP, will likely extend the developmental limitations of Moore’s Law.

Information presented during Semicon Taiwan 2021 shows that EDA companies are basing their heterogeneous integration strategies mainly on the connection between upstream and downstream parts of the semiconductor supply chain, in addition to meeting their goals through chip packaging architectures. At the moment, significant breakthroughs in packaging technology design and architecture remain unfeasible through architectural improvements exclusively. Instead, companies must integrate their upstream chip design and power output with downstream substrate signal transmission and heat dissipation, as well as other factors such as system software and use case planning. Only by integrating the above factors and performing the necessary data analysis can EDA companies gradually evolve towards an optimal packaging architecture and in turn bridge the gap of SoC architectures.

With regards to automobiles (including ICE vehicles and EVs), their autonomous driving systems, electronic systems, and infotainment systems require numerous and diverse semiconductor key components that range from high-end computing chips to mid-range and entry-level MCUs. As such, automotive chip design companies must carefully evaluate their entire supply chain in designing automotive chip packages, from upstream manufacturers to downstream suppliers of substrates and system software, while also keeping a holistic perspective of various use cases. Only by taking these factors into account will chip design companies be able to respond the demands of the market with the appropriate package architectures．

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Sales of gaming consoles underwent palpable growth in 1H21 thanks to the release of new consoles as well as demand that had previously been deferred in 2020 due to material shortages. Moving into 2H21, however, disruptions in logistics/transportation and the further spread of the COVID-19 pandemic led to less-than-expected sales volumes during the holiday season, estimated in total annual sales of 51.257 million consoles for the whole 2021. While the Nintendo Switch remained the market leader with sales of 26.19 million units, about 14.31 million units of the Sony PS5 were sold, compared to 8.14 million units of the Microsoft Xbox Series X|S.

As the aforementioned issues related to the pandemic, logistics, and shortages gradually become resolved, TrendForce expects gaming console sales for 2022 to reach 57.94 million units, a 13% YoY increase. Although the Switch will likely retain its market leadership, sales will hold flat and begin to show signs of decline, as the console enters its fifth year. TrendForce expects Nintendo to release a refreshed version of the Switch console in early 2023 in response to gradually declining sales.

After expanding the PS5 user base, Sony is expected to make a heavy push for its next-gen VR products, the PS VR 2, which will likely be released at the end of 2022. At the same time, Sony will continue to strengthen the development of both games with VR content and VR-related accessories, which can further improve the gaming experience of PS VR users. Microsoft, on the other hand, has placed an emphasis on not only its Xbox Cloud Gaming streaming service, but also the acquisition of game development studios to increase its exclusive game titles, attract consumers, and weaken its competitors. Hence, Microsoft may potentially release its own affordably priced game streaming boxes this year to be used in conjunction with cloud-based game streaming services. However, due to the nature of Xbox Cloud Gaming as a cross-platform service compatible with, among other devices, the previous-gen Xbox One, consumers may in turn be less willing to purchase the Xbox Series X|S, thereby lowering annual sales of these consoles and widening the sales gap between the Series X|S and their competitors.

Switch-like handheld gaming consoles will continue to appear

Rising sales of the Nintendo Switch consoles have led other brands to release similar products in response. In addition, the barrier to entry in the handheld gaming console market has been significantly lowered now that Qualcomm is able to supply chips, reference designs, and dev tools. With brands now willing to cross over to this space, the market may see the emergence of multiple Switch-like handheld gaming consoles in 2022.

Unlike prevailing gaming consoles which have closed ecosystems, products such as the Steam Deck are based on open platforms that are compatible with gaming contents and streaming services available on PCs and mobile devices. As such, these handheld gaming consoles are not an absolute requirement for consuming game content, and consumers may still prefer using their existing PCs or mobile devices for such content.

As well, brands that look to release their own handheld gaming consoles will not look to compensate for reduced hardware profitability through software sales. As a result, these consoles will be priced relatively high, at an expected US$399 and up, which may negatively affect consumers’ willingness to purchase them. Even if certain brands make an attempt at handheld gaming console production, sales of these consoles are expected to remain mediocre, without making much of an impact on the current gaming console market.

（Image credit: Pixabay）

In recent years, the biggest trend of smartphone camera modules is the increasing number of rear camera modules, according to TrendForce’s investigations. According to TrendForce research, triple camera modules surpassed dual camera modules to become mainstream in 2020 and drove the continued growth of smartphone camera module shipments. Annual smartphone camera module shipments in 2022 are expected to reach 4.92 billion units, or 2% growth YoY.

However, the trend towards multiple cameras started to shift in 2H21 after a few years of positive growth. The previous spike in the penetration rate of four camera modules was primarily incited by mid-range smart phone models in 2H20 when mobile phone brands sought to market their products through promoting more and more cameras. However, as consumers realized that the macro and depth camera usually featured on the third and fourth cameras were used less frequently and improvements in overall photo quality limited, the demand for four camera modules gradually subsided and mobile phone brands returned to fulfilling the actual needs of consumers. In addition, increases in the pricing of semiconductor chips such as PMICs and Driver ICs, as well as increased shipping costs, have driven the cost of mobile phones up sharply. Without the ability to effectively pass this cost onto consumers, any remaining allowance to economically install low-end cameras has been effectively eliminated.

Camera resolution upgrades: fastest growing market share encompasses 49-64 million pixel cameras

Although camera shipment growth has slowed, camera resolution continues to improve. Taking primary cameras as an example, the current mainstream design is 13-48 million pixels, accounting for more than 50% of cameras in 2021. In second place are products featuring 49-64 million pixels which accounted for more than 20% of cameras last year with penetration rate expected to increase to 23% in 2022. The third highest portion is 12 million pixel products, currently dominated by the iPhone and Samsung’s flagship series. However, a 48 million pixel primary camera is expected to be introduced to the iPhone 14 Pro series (tentative name) that Apple will release this year, further reducing 12 million pixel products to a 15% share in 2022.

In addition to the original Samsung and Xiaomi brands employing 108 million pixels cameras, Vivo and Honor also introduced similar resolution cameras in 2021. There is a chance 200 million pixel products will be ready for commercial use in 2022, driving the penetration rate of ultra-high pixel products to an expected level in excess of 5% in 2022. However, such ultra-high pixel products primarily focus on enlarging photographs without losing image quality. Therefore, TrendForce believes that any marginal benefits these products bring to consumers will gradually decrease and the penetration rate will not grow as quickly as 49-64 million pixels products.

Overall, TrendForce believes that the number of camera modules mounted on smartphones will no longer be the main focus of mobile phone brands, as focus will return to the real needs of consumers. Therefore, triple camera modules will remain the mainstream design for the next 2~3 years.

In recent years, the biggest trend of smartphone camera modules is the increasing number of rear camera modules, according to TrendForce’s investigations. According to TrendForce research, triple camera modules surpassed dual camera modules to become mainstream in 2020 and drove the continued growth of smartphone camera module shipments. Annual smartphone camera module shipments in 2022 are expected to reach 4.92 billion units, or 2% growth YoY.

However, the trend towards multiple cameras started to shift in 2H21 after a few years of positive growth. The previous spike in the penetration rate of four camera modules was primarily incited by mid-range smart phone models in 2H20 when mobile phone brands sought to market their products through promoting more and more cameras. However, as consumers realized that the macro and depth camera usually featured on the third and fourth cameras were used less frequently and improvements in overall photo quality limited, the demand for four camera modules gradually subsided and mobile phone brands returned to fulfilling the actual needs of consumers. In addition, increases in the pricing of semiconductor chips such as PMICs and Driver ICs, as well as increased shipping costs, have driven the cost of mobile phones up sharply. Without the ability to effectively pass this cost onto consumers, any remaining allowance to economically install low-end cameras has been effectively eliminated.

Camera resolution upgrades: fastest growing market share encompasses 49-64 million pixel cameras

Although camera shipment growth has slowed, camera resolution continues to improve. Taking primary cameras as an example, the current mainstream design is 13-48 million pixels, accounting for more than 50% of cameras in 2021. In second place are products featuring 49-64 million pixels which accounted for more than 20% of cameras last year with penetration rate expected to increase to 23% in 2022. The third highest portion is 12 million pixel products, currently dominated by the iPhone and Samsung’s flagship series. However, a 48 million pixel primary camera is expected to be introduced to the iPhone 14 Pro series (tentative name) that Apple will release this year, further reducing 12 million pixel products to a 15% share in 2022.

In addition to the original Samsung and Xiaomi brands employing 108 million pixels cameras, Vivo and Honor also introduced similar resolution cameras in 2021. There is a chance 200 million pixel products will be ready for commercial use in 2022, driving the penetration rate of ultra-high pixel products to an expected level in excess of 5% in 2022. However, such ultra-high pixel products primarily focus on enlarging photographs without losing image quality. Therefore, TrendForce believes that any marginal benefits these products bring to consumers will gradually decrease and the penetration rate will not grow as quickly as 49-64 million pixels products.

Overall, TrendForce believes that the number of camera modules mounted on smartphones will no longer be the main focus of mobile phone brands, as focus will return to the real needs of consumers. Therefore, triple camera modules will remain the mainstream design for the next 2~3 years.

For additional insights from TrendForce analysts on the latest tech industry news, trends, and forecasts, please visit our blog at https://insider.trendforce.com/

Driven by forces such as the pandemic, geopolitics, and the digital transformation of everyday life, there has been a shortage of global foundry production capacity for nearly two years and shortages have been especially severe for mature 1Xnm~180nm nodes, according to TrendForce’s investigations. Although all foundries are furiously increasing capital expenditures to expand capacity, unrealized future expansion does not ease existing supply issues. In addition, the uneven distribution of supply chain resources that has exacerbated the shortage of parts and components has yet to be definitively alleviated. Circumstances as a whole will continue affecting shipments of related whole devices. Only the PC category is expected to emerge largely unscathed in 1Q22.

Moving into 1Q22, TrendForce states, due to the limited increase in production capacity, the market’s supply situation is expected to be approximately the same as in 4Q21. However, some end products have entered their traditional off-season cycle and the slowdown in demand momentum is expected to alleviate the immediate pressure on OEMs and ODMs regarding supply chain stocking.

In terms of the whole servers, the FPGA delivery cycle is currently at over 50 weeks at most, while the delivery cycle of Lan chips has improved significantly, from the original 50+ weeks to approximately 40 weeks. However, escalating purchase order activity caused by the uncertainty of the pandemic combined with an accumulated backlog of demand (Back order/backlog) have pushed the SMT capacity of ODMs to full load in general. The aforementioned phenomenon have not only accelerated the consumption of ICs such as FPGA and PMIC, but the demand for additional purchase orders of FPGA, PMIC and MOSFET is still compelling. The overall market remains tight and the production of server motherboards in the future may face hidden issues. TrendForce has ascertained a more crucial matter. Taking the L6 server as an example, its production scale in 1Q22 will be roughly the same as the previous quarter. However, whole server shipments will show a seasonal decline with a decrease of approximately 8% QoQ.

In terms of mobile phones, material shortages have gradually eased from the second half of 2021 partly due to the discretionary adjustment of mobile phone specifications. Mobile phone brands can adjust their specifications and configurations based on available materials. Currently, the supply of four components remains relatively tight. Among them, 4G SoC (30-40 weeks) and OLED DDIC/Touch IC (20-22 weeks) have a significant impact on the market. The former will affect brands that focus on selling 4G mobile phones. The latter is affected by oligopolistic market structure and the adjustment of foundry capacity. Thus, there are rumblings of insufficient supply. Though the supply of the remaining two items, PMIC and A+G Sensor, remains tight, material shortage risk can be largely mitigated through alternative material replacements or the adjustment of specifications and configurations. In terms of production, the 1Q22 supply chain will essentially carry on its performance from the previous quarter. However, due to disappointing holiday demand at the end of 2021, mobile phone brands must adjust the distributed inventory level of finished products in a timely manner. Combined with uncertainty caused by disruptions stemming from a winter-time pandemic, 1Q22 production performance is estimated to fall by approximately 13% QoQ.

In terms of PCs and laptops, starting from November 2021, material shortages have been partially alleviated. Therefore, the shipment volume of PC ODMs in 4Q21 has been revised upwards. Compared with mobile phones and whole servers, the impact of under/oversupply of materials on end PCs and notebooks is relatively minor. Except for the SSD PCIe 3.0 controller, current tightness exhibited in component supply is due to delays in the transition of Intel’s new platform. This temporary shortfall has led to a delivery cycle of approximately 8-12 weeks while any tightness in the supply of Type C IC, WiFi, and PMIC is gradually abating. TrendForce expects that, as overall supply chain stability recuperates, notebook shipments from ODM brands in 1Q22 will only decrease by 5.1% QoQ. However, if the component shortage factor is discounted, subsequent sales originating from various distribution channels will be another major variable TrendForce must consider.

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com