Following the footsteps of semiconductor bellwethers TSMC and Intel, as well as memory giants Micron and SK hynix, Samsung has hopped on the last minute opportunity of securing the funding under the CHIPS Act in Biden’s term. According to U.S. Department of Commerce, it has finalized a nearly USD ...

According to Liberty Times, ASML President and CEO Christophe Fouquet discussed geopolitical issues in the semiconductor industry and China lagging behind the West in chip manufacturing during an interview with the Dutch media outlet NRC. Regarding the U.S.'s ongoing restrictions on China's sem...

Amid the booming demand for advanced packaging used in AI chips, TSMC Chairman C.C. Wei confirmed in the July earnings call that the company has been working on a mini production line for FOPLP (Fan-Out Panel Level Packaging), with achievements expected within three years. Now here’s the latest...

TSMC and Samsung are not just archrivals in the foundry market. They also confront each other in an emerging sector, the Fan-Out Panel-Level Packaging (FOPLP) technology. According to South Korean media outlet ETnews, the two semiconductor giants, while both eyeing FOPLP as a secret weapon to high-p...

Leading GPU manufacturer NVIDIA recently unveiled its vision for future AI chip designs featuring silicon photonics at the IEDM 2024 conference. According to a report from Business Korea, NVIDIA highlighted the potential of silicon photonics for chip-to-chip connections within AI data centers, drawi...