A few weeks ago, Intel is said to be seeking assistance from the U.S. government, as CEO Pat Gelsinger reportedly turned to Commerce Secretary Gina Raimondo to emphasize the significance of U.S. chip manufacturing. Now here’s the latest development: according to a report by Bloomberg, the U.S. House has passed a bill that exempts certain semiconductor manufacturing projects from federal permitting requirements, which is expected to benefit companies like Intel and TSMC.

According to Bloomberg, the move aims to alleviate concerns that environmental reviews and legal challenges could slow the construction of domestic chip plants.

The report notes that spurred by incentives from the 2022 Chips and Science Act, chipmakers have committed around USD 400 billion to build factories in the US. Companies such as Intel and TSMC are set to receive billions in funding from the act to support major projects nationwide. Other tech giants, including Micron, Samsung, SK hynix and GlobalFoundries, are also getting billions in U.S. subsidies.

However, many of the projects are facing delays. For instance, Intel’s Fab 52 and Fab 62 in Arizona are previously scheduled to be completed in 2024. However, the schedule may be reportedly delayed a bit, as the fabs are likely to begin operations later this year or in early 2025. The USD 20 billion project in Ohio, on the other hand, may be facing larger obstacles as Intel has delayed the plan after 2026 due to market downturns and delays in U.S. subsidies.

The pending awards, according to Bloomberg, currently require semiconductor construction sites to undergo National Environmental Policy Act (NEPA) reviews, a process that could last months or even years. Now it would be streamlined by the legislation passed on Monday.

The bill specifies three criteria for Chips Act-funded projects to qualify for a NEPA exemption, Bloomberg states.

First, projects must begin construction before the end of this year, a requirement that most major sites should be able to meet, except for a Micron’s project in New York, which has not yet met permitting requirements under the Clean Water Act and various state regulations, Bloomberg explains.

Second, projects that receive only loans—not direct grant funding—would be exempt from NEPA reviews, although this provision currently does not apply to any Chips Act incentive packages.

Finally, facilities would qualify for an exemption if grant funding constitutes less than 10% of project costs, a decrease from the previous threshold of 15% in an earlier version of the legislation, the report notes.

It is worth noting that the proposal, waiting for Biden’s nod, illustrates the dilemma the U.S. government is currently facing. For one thing, the U.S. authority is eager to expedite the construction of chip factories to reduce reliance on Asia, particularly Taiwan. On the other hand, the White House has set ambitious climate goals, and building semiconductor plants could complicate efforts to achieve these targets, according to Bloomberg.

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• [News] Intel Reportedly Sought Commerce Secretary Raimondo’s Help over U.S. Reliance on TSMC

(Photo credit: Intel)

In mid-August, TSMC had signed a contract with panel manufacturer Innolux to purchase its plant and facilities located in southern Taiwan, eyeing to further expand its advanced packaging capacity. According to a report by China Times, the fab, designated as the AP8 facility, is expected to start production in the second half of 2025.

More importantly, the fab will not only provide foundry services but also the eagerly needed capacity for advanced 3D Chip on Wafer on Substrate (CoWoS) IC packaging services, the report notes.

The move will be critical for TSMC to meet the surging demand for the advanced packaging capacity for AI servers, according to the report. Its future capacity will reportedly be nine times that of AP6, TSMC’s advanced packaging fab in Zhunan.

Outbidding Micron, TSMC secured the plant with a transaction value of NTD 17.14 billion, which is much lower than the rumored market price of over NTD 20 billion. Citing sources from the supply chain, the report suggests that the main reason TSMC acquired Innolux’s fab was to bypass the time-consuming environmental assessment process.

Unlike the advanced packaging fab in Chiayi, central Taiwan, which has to be started from scratch, the newly-acquired facility only requires internal modifications. Within a year, TSMC can finish the job of equipment installation, and begin the production afterwards.

Sources cited by the report note that orders for related equipment manufacturing are already underway, with deliveries expected starting in April next year. While the process of trial production may take an additional quarter, the AP8 facility is expected to start production in the second half of 2025.

During an investor conference in mid-April, TSMC Chairman C.C. Wei stated that he anticipates the company’s CoWoS capacity to more than double in both 2024 and 2025. He noted later in July that TSMC targets to reach the balance between supply and demand by 2026.

According to analysts cited by the report, TSMC’s CoWoS capacity, though still remains in short supply, could exceed 32,000 wafers per month by the end of this year. With the additional outsourced capacity, the total CoWoS capacity may approach 40,000 wafers per month. By the end of 2025, TSMC’s CoWoS monthly capacity is projected to reach around 70,000 wafers.

Citing remarks by Jun He, TSMC Vice President of Operations and Advanced Packaging Technology and Service, TSMC’s CoWoS capacity is expected to achieve a compound annual growth rate (CAGR) of over 50% from 2022 to 2026. The foundry giant will also accelerate its pace on constructing fabs, shortening the typical 3-to-5-year timeline to within 2 years to meet customer demand.

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• [News] TSMC Took Another Step in Advanced Process Expansion

(Photo credit: TSMC)

According to a Wall Street Journal report cited by Reuters, two of the world’s largest chipmakers, TSMC and Samsung Electronics, have explored potential chip projects in the United Arab Emirates (UAE) that could be worth over $100 billion in the coming years.

Top executives from TSMC have visited the UAE and discussed building a chip plant complex comparable to the company’s most advanced facilities in Taiwan, WSJ reported, citing sources familiar with the talks.

In response to the rumors, TSMC stated that the company always welcomes constructive discussions that promote the development of the semiconductor industry with an open attitude. TSMC is currently focused on its existing global projects and has no specific plans for new overseas investments at this time.

South Korea’s Samsung Electronics is also considering large-scale chip manufacturing operations in the UAE, with the discussions still in early stages, according to unnamed sources cited by WSJ.

Senior figures from Samsung recently visited the UAE and engaged in discussions about the project, though it is still in its infancy and could face technical and other challenges, the WSJ noted.

Neither TSMC nor Samsung responded immediately to Reuters’ request for comment.

The UAE is expected to fund these projects, with Abu Dhabi’s sovereign wealth fund, Mubadala, playing a central role, WSJ said, adding that the broader aim is to increase global chip production and lower prices without cutting into chipmakers’ margins.

As tech deals accelerate in the region, Washington has grown more concerned about the UAE and other Middle Eastern countries becoming channels for advanced U.S. AI technology reaching China.

Notably, the UAE has recently made strides in positioning itself as a key player in advanced technologies. In March, the Financial Times reported that Abu Dhabi’s newly formed AI investment company, MGX, had begun preliminary discussions with OpenAI regarding chip business investments—part of the UAE’s ambition to become a global leader in AI development.

Earlier this year, in February, the WSJ also reported that OpenAI CEO Sam Altman had met with investors in the UAE and other regions to discuss massively scaling up production of chips, power, and other key AI infrastructure—a move that could eventually require up to $7 trillion in investments.

(Photo credit: TSMC)

For Intel, last week was like a roller coaster. On Monday, the company settled down plans for restructuring after the board meeting. On Friday, however, according to reports by The Wall Street Journal and Bloomberg, it turns out that Qualcomm has reportedly reached out to Intel regarding a potential acquisition offer, which would rank as one of the largest-ever technology mergers if the deal were to take place.

Should Qualcomm take over Intel, the mega deal may have limited impact on TSMC, the world’s largest foundry. However, Taiwanese smartphone chip giant MediaTek would be more heavily impacted, according to Taiwanese media the Economic Daily News and Commercial Times.

Citing domestic and foreign institutional investors, the Economic Daily News notes that regarding that the Broadcom-Qualcomm saga came to an abrupt end in 2018, the likelihood of the Qualcomm-Intel deal to realize might be low. However, if the acquisition does go through, it could create certain impact on Taiwanese manufacturers.

Citing remarks from Hong Kong-based and foreign semiconductor analysts, the report by the Economic Daily News points out that Intel’s weakness in its foundry unit would be its fatal flaw. With Intel’s yield rates and performance in the advanced nodes lagging behind TSMC, even if Qualcomm successfully acquires Intel, it is expected that Qualcomm would not reclaim the orders currently outsourced to TSMC, indicating the impact to the Taiwan-based foundry giant would be minimal.

Furthermore, the report suggests that from Qualcomm’s perspective, the more logical scenario would be to acquire only Intel’s chip design business. However, from Intel’s standpoint, they would prefer to sell the entire company as a package. Thus, the analysts cited by the report project that Qualcomm is more likely to spin off Intel’s chip manufacturing business and sell it to a U.S. private equity firm after the acquisition.

Actually, in early September, a report by Reuters suggests that Qualcomm, known for its Snapdragon processors used in smartphones, had investigated the possibility of acquiring parts of Intel’s design business to enhance its product portfolio, and was particularly interested in Intel’s PC business.

On the other hand, the story may be different for Taiwanese chip makers. A report by the Commercial Times notes that the acquisition could create pressure on MediaTek, which is Qualcomm’s main rival, as it may face even fiercer competition in sectors like AI PCs and automotive platforms, of which the Taiwanese smartphone chip giant is expected to launch new products next year.

In addition, the takeover would also have negative impact on AMD’s supply chain in Taiwan, including companies like ASMedia, which specializes in high-speed Switch IC, USB, PCIe and SATA controllers, Commercial Times indicates.

It is worth noting that the potential deal would face significant challenges, particularly with antitrust and national security concerns, a report by CNBC notes. For instance, Intel’s recent attempt to acquire Tower Semiconductor and Qualcomm’s bid for NXP Semiconductor were both blocked by Chinese authorities, the report says.

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• [News] Qualcomm Rumored to Consider Acquiring Parts of Intel’s Chip Design Business, with a Focus on PC Segment
• [News] Intel to Turn Foundry Unit into Subsidiary, with Projects in Germany and Poland Delayed for 2 Years

(Photo credit: Qualcomm)

In early September, rumors have it that TSMC’s first US fab in Arizona began producing engineering wafers using the 4nm process in April, with yields reportedly comparable to those manufactured in its Southern Taiwan Science Park facility. Now here’s the latest update: the fab has started trial production for Apple’s A16 chip, according to a report by Tim Culpan at substack, a technology columnist.

Tim Culpan notes that the mobile processors are manufactured with TSMC’s 5nm, or the so-called N4P node, which is the same as the node used in Taiwan to manufacture A16. The N4P node is actually a member of the 5nm family, as it is regarded as an enhanced version of 5nm, the report explains.

It is worth noting that Apple’s A16 SoC, though launched two years ago with iPhone 14 Pro, is considered as one of the most advanced mobile chips for the company, as the chip is also be seen in iPhone 15 and iPhone 15 Plus models. Culpan indicates that the move marks a milestone that instead of beginning with some less critical chips, Apple and TSMC intend to aim high from the start.

According to Culpan, Apple’s A16 is currently being trial-produced at TSMC Arizona’s “Fab 21” Phase 1 facility, with a small production volume. However, once the second stage of the Phase 1 fab is completed, the output will significantly increase.

TSMC plans to build three plants in Arizona, each with cleanroom spaces twice the size of typical logic fabs in the industry. The first fab is expected to begin mass production in the first half of 2025.

TSMC’s second fab in Arizona will use 2nm process technology to meet strong AI-related demand, with production expected to begin in 2028. The third fab will employ 2nm or even more advanced process.

However, the situation for Samsung’s investment in the U.S. would be a different story. A previous report from Korean media outlet Business Korea noted that persistent issues with its 2nm yield rate have led Samsung to decide to withdraw personnel from its Taylor, Texas plant, signaling another setback for its advanced wafer foundry business.

As for Intel, which proactively pursues the support of the U.S. government, it is holding steadfast on its investments in the country despite recent announcements to spin-off its foundry business and delaying the projects in Germany and Poland for two years.

Intel plans to invest USD 100 billion over the next five years in new fabs and expansions across Arizona, New Mexico, Ohio, and Oregon, creating 10,000 manufacturing jobs and 20,000 construction jobs.

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• [News] Showing Positive Progress, TSMC’s Arizona Fab Reportedly Reaches Production Yields on Par with Taiwan
• [News] TSMC Receives USD 6.6 Billion for Chipmaking from the US Government, Commits to Constructing Third Fab

(Photo credit: Apple)