TSMC


2023-09-08

[News] Reportedly, TSMC’s U.S. Factory Plans Small-Scale Trial Line for Q1 2024

According to a report by Taiwan's Money DJ, the production schedule for TSMC's semiconductor foundry in the United States has been delayed until 2025, raising concerns among observers. However, Chairman Mark Liu, in an interview on the 6th, stated that there has been significant progress over the pa...

2023-09-08

Continuing Moore’s Law: Advanced Packaging Enters the 3D Stacked CPU/GPU Era

As applications like AIGC, 8K, AR/MR, and others continue to develop, 3D IC stacking and heterogeneous integration of chiplet have become the primary solutions to meet future high-performance computing demands and extend Moore's Law. Major companies like TSMC and Intel have been expanding their i...

2023-09-07

[News] CoWoS Production Shortage, TSMC Expects Capacity Will Catch Up in 1.5 Years

According to Taiwan's Economic Daily, TSMC Chairman Mark Liu stated on 9/6 that semiconductor technology development "has reached the exit of the tunnel, and there are more possibilities beyond the tunnel; we are no longer bound by the tunnel." Regarding TSMC's progress in establishing a factory ...

2023-09-06

Huawei’s Mate 60 Pro Impresses Market, SoC Competition Key Against Qualcomm/MediaTek

Huawei's official website unexpectedly unveiled its latest flagship smartphone, the Mate 60 Pro, on August 29, 2023, followed by the release of the Mate 60 the next day. The Mate 60 Pro's performance, powered by the Kirin 9000S SoC, has garnered significant attention in the market. TrendForce's I...

2023-09-05

[News] Taiwan Micron Focuses on HBM Advanced Process and Packaging

According to Taiwan's TechNews report, Lu Donghui, Chairman of Micron Technology Taiwan, stated that in response to the growing demand in the AI market, Micron Technology Taiwan will continue to invest in advanced processes and packaging technologies to produce High Bandwidth Memory (HBM) products. ...

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