According to the Korea Economic Daily. Samsung Electronics' HBM3 and packaging services have passed AMD's quality tests. The upcoming Instinct MI300 series AI chips from AMD are planned to incorporate Samsung's HBM3 and packaging services. These chips, which combine central processing units (CPUs), ...

In response to the demands of high-performance computing, AI, 5G, and other applications, the shift towards chiplet and the incorporation of HBM memory has become inevitable for advanced chips. As a result, packaging has transitioned from 2D to 2.5D and 3D formats. With chip manufacturing advanci...

According to Taiwan's Commercial Times, TSMC continues to face challenges from ongoing price undercutting and competitive bidding in mature semiconductor manufacturing processes. Concerns arise about the company's ability to offset these challenges with AI-related orders. Reports from the market sug...

In recent market speculations, TSMC is rumored to have reduced its 8-inch wafer manufacturing quotes by as much as 30%, with subsequent reports suggesting that South Korean wafer foundries are following suit in lowering 8-inch wafer production prices. According to TrendForce's channel check, TSMC...

According to a report by Taiwan's Commercial Times, global smartphone brands are set to introduce a series of flagship-level new products. Following the introduction of Apple's A17 chip using TSMC's 3-nanometer process, Qualcomm's next-generation processor Snapdragon 8 Gen 3 and MediaTek's Dimensity...