TSMC


2023-06-26

HBM and 2.5D Packaging: the Essential Backbone Behind AI Server

With the advancements in AIGC models such as ChatGPT and Midjourney, we are witnessing the rise of more super-sized language models, opening up new possibilities for High-Performance Computing (HPC) platforms. According to TrendForce, by 2025, the global demand for computational resources in the ...

2023-06-14

AI Servers: The Savior of the Supply Chain, Examining Key Industries

NVIDIA's robust financial report reveals the true impact of AI on the technology industry, particularly in the AI server supply chain. ......

2023-06-08

Decoding Apple’s Display Choice: Micro OLED Triumphs over Micro LED in Vision Pro

Apple's latest MR device, the "Vision Pro," utilizes Micro OLED technology. This technology, along with Micro LED, is considered the next generation of display technology. So what are the differences between Micro OLED and Micro LED, and which one is better suited for AR/VR/MR devices? According ...

2023-06-07

TSMC Lowers Full-Year Semiconductor Growth Forecast, But Advanced Packaging Demand Outstrips Supply

Semiconductor manufacturing leader TSMC held its annual shareholder meeting on June 6, addressing issues including advanced process development, revenue, and capital expenditure. TSMC's Chairman Mark Liu and President C.C. Wei answered a series of questions. The key points from the industry are summ...

2023-06-06

Disruption in 2.5D/3D Packaging: Hybrid Bonding Rising as New Cornerstone

The surge in AIGC and new technologies such IoT, AI, 5G, AR/VR are driving a huge demand for computational power of high-end chips. This has been even outpacing the performance increase offered by the long-standing Moore's Law, ushering in a "post-Moore" era where revolutions in advanced chip design...

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