As the semiconductor industry continues to advance, it has sparked an arms race among Samsung, Intel, and TSMC in acquiring extreme ultraviolet (EUV) equipment. When asked about when TSMC would adopt the extremely expensive High Numerical Aperture EUV (High-NA EUV) lithography equipment, as per a report from Economic Daily News, TSMC’s Senior Vice President of Business Development and Global Sales at TSMC, Kevin Zhang, also revealed his insight regarding the matter in an interview.

Reportedly, High-NA EUV machines are priced as high as USD 380 million each, more than double the cost of regular EUV machines. Samsung and Intel have already invested heavily, purchasing several High-NA EUV machines ahead of TSMC, hoping to gain a competitive edge through more advanced equipment.

Industry sources cited by the report point out that Kevin Zhang did not reveal the exact timeline for TSMC’s purchase of High-NA EUV, indicating that TSMC is confident and will not blindly expand its procurement just because competitors have made early purchases. Instead, TSMC will continue to strategically plan its advanced manufacturing processes, steadily preparing to meet upcoming challenges.

Youtube channel TechTechPotato recently uploaded a 29-minute interview with Kevin Zhang. During the interview, Zhang emphasized that TSMC was the very first in terms of bringing EUV into high-volume manufacturing as early as the 7nm generation.

Zhang pointed out that TSMC currently leads in the usage, mass production, and production efficiency of EUV technology. Zhang also mentioned that scalability and manufacturing costs are significant factors to consider. He believes that TSMC’s R&D team will make the best decision regarding when and where to apply the next generation of EUV technology.

Notably, according to a report from The Chosun Daily, it pointed out that TSMC was expected to maximize the capabilities of its existing EUV equipment and utilize them through multi-patterning techniques. Simultaneously, the company was also evaluating the scale at which additional equipment may be introduced.

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(Photo credit: ASML)

According to a report from Commercial Times, TSMC’s advanced processes continue to experience strong demand, with major tech companies such as Apple, Qualcomm, NVIDIA, and AMD nearly fully booking TSMC’s 3nm capacity, while the order visibility extends into 2025.

As per the same report, the supply chain of the foundry giant’s 3nm process is also expected to continue the momentum, benefiting companies like Gudeng Precision Industrial (Gudeng), KINIK Company (KINIK), Solar Applied Materials Technology Corp (Solar Applied Materials), YEEDEX and GreenFiltec.

Industry sources cited by the same report indicate that TSMC’s wafer prices for advanced process are expected to see double-digit percentage increases by 2025. Chairman C.C. Wei recently mentioned that TSMC’s wafer pricing is strategic, as values regarding products may differ. The progress in pricing negotiations with customers is “so far so good,” and TSMC is confident about achieving a balance between price and capacity.

A report from Wccftech also suggested that Apple’s upcoming A18 Pro SoC and NVIDIA’s next-generation “Rubin” architecture will both use the 3nm process. Following the widespread adoption of TSMC’s 3nm process, the 3nm supply chain has attracted significant market attention, with expectations for operational boosts in the coming year.

In the semiconductor industry, per the sources cited by Commercial Times, Gudeng has captured about 70% of the market share for EUV POD. As EUV lithography has become a standard in advanced processes, TSMC has been adopting EUV technology starting from the 7nm process node and increasing its usage in later generations. The number of EUV layers used per wafer has been growing, which bodes well for Gudeng as it continues to benefit from this trend.

In the semiconductor sputtering target materials sector, TSMC has traditionally relied on products from international suppliers. However, with a push towards domestic equipment and consumables, Solar Applied Materials entered TSMC’s advanced 7nm process supply chain last year and has now also become a supplier for the 3nm process. Solar Applied Materials’ revenue from semiconductor targets was 4% last year and is expected to reach 10% this year, with a target of 20% by 2026, according to the report.

YEEDEX specializes in supplying components for the front-end processes, such as precision vaccum chucks for EUV equipment. As the industry moves to 3nm processes, wafer thinness increases, making precision vaccum chucks crucial for improving yield rates.

GreenFiltec specializes in extractable chemical filters and AMC Micro Pollution Control services. Through innovative material research and development for filters, GreenFiltec prevents invisible gas molecules from settling in the air. These filters are key consumables for cost control and yield improvement. In the domestic advanced process market, GreenFiltec has captured over 50% of the market share, and its operations are expected to benefit similarly next year, the report noted.

KINIK produces reclaimed wafers and diamond discs. Its high-spec diamond disc products have gained continuous and expanded adoption from major clients, achieving over 70% market share in the 3nm segment. The sources cited by Commercial Times expect that as major clients’ 3nm production capacity reaches full utilization, KINIK’s performance will significantly improve starting next year.

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(Photo credit: TSMC)

With the U.S.-China tech war heating up as the U.S. election approaches, industry sources cited by the Economic Daily News report that Chinese IC design companies are rushing to place more orders with TSMC for chip production using advanced processes before the U.S. potentially imposes stricter control policies. At the same time, they are initiating a backup plan by shifting orders to Samsung for chips manufactured with advanced nodes to avoid potential future U.S. bans on Chinese companies using Taiwanese foundries.

As a result, Samsung is becoming a beneficiary of the escalating U.S.-China tech conflict, sparking a new round of competition for orders with TSMC. As of the deadline for this report, TSMC has not responded to these rumors.

Per TSMC’s second-quarter financial report, the revenue proportion from China increased significantly from 9% in the first quarter to 16% in the second quarter. This surpasses other Asia-Pacific regions, making China the second-largest source of revenue after North America, which accounts for 65%.

The same report cites sources indicating that the increase in TSMC’s revenue share from China last quarter is likely due to Chinese IC design companies sensing potential future U.S. pressure that could prevent them from placing orders with TSMC.

As a result, these companies have been placing larger orders in advance to stockpile chips, similar to the situation previously seen when Huawei’s HiSilicon placed massive orders with TSMC to stockpile chips just before being blacklisted by the U.S.

It is understood that although the related Chinese IC companies may not using the most advanced processes, they are employing relatively advanced processes, which have been developed over several years, and applied in areas such as ADAS, mobile phones, and high-speed computing. Recently, these customers have continued to place orders with TSMC and have also begun evaluating backup plan, which involves switching orders to Samsung.

Sources cited by the report also pointed out that while Chinese IC design houses would like to diversify risks regarding the relatively advanced nodes by placing orders with companies other than TSMC, they may not be allowed to collaborate with Intel. This is why Samsung may emerge as an option.

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(Photo credit: TSMC)

TSMC announced last year that it would build a plant in Dresden, Germany. The plant is originally expected to break ground as early as Q4 this year, but now it may start sooner. According to a report from Deutsche Welle, TSMC’s Dresden plant will begin construction within a few weeks, which means it will start this fall, aligning with the company’s previously announced timeline.

The TSMC Germany plant was initially scheduled to begin construction in the second half of 2024 and to start production by late 2027. The new plant is expected to create approximately 2,000 direct high-tech jobs. TSMC will hold a 70% stake in the plant, with Bosch, Infineon, and NXP each holding 10% stakes, and TSMC will operate the facility. The EU and the German government are subsidizing about half of the plant’s investment.

To ensure the plant can commence production smoothly in 2027, the city of Dresden is investing EUR 250 million to build an industrial water supply system and enhance the reliability of the local power grid.

The TSMC Germany plant is expected to use 28/22nm planar CMOS and 16/12nm FinFET process technologies, with a monthly production capacity of approximately 40,000 300mm (12-inch) wafers.

On the other hand, another global semiconductor giant, Intel, was said to have delayed its construction of Fab 29.1 and 29.2 in Magdeburg, Germany, as the new timeline pushed the start of construction to May 2025, according to a report by Tom’s Hardware, citing German media outlet Volksstimme.

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(Photo credit: TSMC)

According to a report from Wccftech, it’s indicated that with soaring market demand, the shipment volume of NVIDIA’s Blackwell architecture GB200 AI servers has also significantly increased.

As NVIDIA claims, the Blackwell series is expected to be its most successful product. Industry sources cited by Wccftech indicate that NVIDIA’s latest GB200 AI servers are drawing significant orders, with strong demand projected to continue beyond 2025. This ongoing demand is enabling NVIDIA to secure additional orders as its newest AI products remain dominant.

The increasing demand for NVIDIA GB200 AI servers has led to revenue performances of Taiwanese suppliers such as Quanta, Foxconn, and Wistron exceeding expectations. Reportedly, NVIDIA is expected to ship 60,000 to 70,000 servers equipped with GB200 AI server. Each server is estimated to cost between USD 2 million and 3 million, resulting in approximately USD 210 billion in annual revenue from the Blackwell servers alone.

NVIDIA’s GB200 AI chip servers, available in NVL72 and NVL36 specifications, have seen greater preference for the less powerful models due to the growing number of AI startups choosing the more financially feasible NVL36 servers.

Notably, according to the industry sources previously cited in a report from Economic Daily News, TSMC is gearing up to start production of NVIDIA’s latest Blackwell platform architecture graphics processors (GPU) on the 4nm process.

The same report further cited sources, revealing that international giants such as Amazon, Dell, Google, Meta, and Microsoft will adopt the NVIDIA Blackwell architecture GPU for AI servers. As demand exceeds expectations,NVIDIA is prompted to increase its orders with TSMC by approximately 25%.

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(Photo credit: NVIDIA)