According to a report from Commercial Times, TSMC is actively expanding its advanced packaging facilities in Taiwan. With the Tainan facility (AP8) it acquired earlier from Innolux starting small-scale production by the end of 2025, TSMC's CoWoS capacity is expected to triple, rising to 90,000 wafe...

The rapid development of AI, HPC, and other technologies is driving higher demands for semiconductor performance and energy efficiency. Traditional packaging technologies struggle to meet the needs of the AI era, creating an opportunity for advanced semiconductor packaging technologies to shine. ...

Commercial Times, citing a report from The Information, indicated that Apple is currently collaborating with Broadcom to develop its first server chip specifically designed for artificial intelligence (AI) computing, hoping to reduce its reliance on Nvidia. Reportedly, the chip will use TSMC's N3P p...

According to a report from Economic Daily News, at the launch event for the second volume of his autobiography yesterday, TSMC founder Morris Chang shared insights about TSMC's two major rivals, Intel and Samsung. Chang once referred to these two competitors as “700-pound gorillas.” However, bot...

According to a report by Liberty Times, industry sources indicate that TSMC's 2nm trial production yield has exceeded 60%, surpassing expectations. The company is set to begin mass production as scheduled next year, and at that point, it will represent the most advanced node in the world. The rep...