Despite recent issues with NVIDIA's GB200 shipments, the market remains optimistic about long-term AI demand, and CoWoS capacity continues to be in short supply. According to a report from MoneyDJ, TSMC will assign orders of the initial stage of chip stacking in CoWoS packaging, Chip on Wafer (Co...

According to a report from Nikkei on August 5, RS Technologies, a global giant in recycled wafers, has announced that due to increased orders, it will expand the monthly production capacity of its Japanese and Taiwanese plants to 580,000 wafers by 2024. Despite the Japanese plant operating at ful...

As AI giant NVIDIA is said to delay its upcoming Blackwell series chips for months, which are now expected to hit the market around early 2025, the related semiconductor supply chain is experiencing a reshuffle. According to a report by the Korea Economic Daily, Samsung Electronics, which is eager t...

According to a report from Economic Daily News, Innolux President James Yang announced on August 5 that the company is advancing its semiconductor fan-out panel-level packaging (FOPLP) with three key processes, targeting to enter mass production as soon as year-end. The chip-first process tech...

According to a report from Commercial Times, despite ongoing turbulence in the semiconductor industry, including Intel's capital expenditure cuts and reported bottlenecks in NVIDIA's B-series GPU, TSMC's leading position in the industry may remain unshaken. The sources cited in the report note...