Following MediaTek’s launch of its flagship mobile processor, Dimensity 9400, more details about the Taiwanese IC design firm’s next hit, the Dimensity 9500, have already surfaced. According to South Korea media outlet SamMobile, the chipset is likely to be manufactured using TSMC’s N3P node, ...

TSMC is actively expanding its advanced packaging CoWoS capacity, with progress reportedly on track, according to Economic Daily News. Industry sources estimate that, with the inclusion of production capacity from facilities acquired from Innolux (AP8) and those in Taichung, TSMC's CoWoS monthly ca...

With rumors indicating that Apple, one of TSMC’s most critical customers, may delay the adoption of the foundry giant’s 2nm process until 2026, a Commercial Times report, citing Chosun Daily and SamMobile, now suggests that NVIDIA and Qualcomm are following suit, as they are reportedly mulling t...

TSMC's next-generation 2nm development is actively progressing. According to MoneyDJ, industry sources indicate that TSMC has begun setting up a pilot production line for 2nm (N2) at its Hsinchu Baoshan fab (Fab 20) this quarter, with a planned monthly capacity of approximately 3,000 to 3,500 wafers...

With TSMC’s Arizona plant nearing its mass production in early 2025, rumors have been circulating that the foundry giant’s manufacturing costs in the U.S. are at least 30% higher than in Taiwan. Now it seems that a price hike is inevitable, as a report from the Economic Daily News suggests TSMC ...