TSMC's advanced CoWoS packaging capacity is in severe shortage, and just as the new plant in the Chiayi Park of Southern Taiwan Science Park began construction for expansion, according to a report from Economic Daily News citing sources, it has stated that TSMC intends to build another advanced pack...

TSMC is said to be entering the fan-out panel-level packaging (FO-PLP) sector, according to a previous report from Nikkei. Now, a report from Business Korea noted that Samsung is making significant strides in the PLP field, as the tech giant acquired the PLP business from Samsung Electro-Mechanics a...

According to a report from Reuters, it’s rumored that ByteDance, the parent company of TikTok, is collaborating with American chip designer Broadcom to develop an advanced AI processor, which could provide ByteDance with a steady supply of high-end chips. On June 24th, Reuters’ report cited s...

According to a report from Korean media outlet ZDNet Korea, the yield rate for Samsung Electronics' latest Exynos 2500 processor has improved to slightly below 20% from single digits in the first quarter. However, the current yield rate is still said to be falling short of mass production standards...

According to a report by the Economic Daily News, TSMC has secured another AI business opportunity. Following its exclusive contract manufacturing of AI chips for tech giants such as NVIDIA and AMD, TSMC, in collaboration with its subsidiary, the ASIC design service provider Global Unichip Corporati...