As AI semiconductor competition intensifies, the wafer foundry industry faces new challenges due to stagnant demand and excess capacity. The battle for dominance in the high-bandwidth memory (HBM) market is also escalating.

According to Business Korea, Samsung has extended the operation time of its Taylor plant from the end of 2024 to 2026, possibly adjusting the investment pace in consideration of the foundry market.

Regarding the global wafer foundry industry outlook for this year, TSMC President C.C. Wei stated that the growth of the global foundry industry this year has been revised from the previous earnings call of 20% to mid-teens.

Currently, TSMC’s two fabs in Arizona, USA, are scheduled to commence production in 2025 and 2028, respectively; the Kumamoto fab in Japan has started operations in February, and the second fab will start production before 2027. Intel, on the other hand, plans to establish new foundries in the United States, Europe, and Israel. The activation of these new fabs has raised concerns in the market about oversupply issues.

Contrastingly, in the HBM market, crucial for AI chips, SK Hynix and TSMC have formed an alliance, intensifying the competition between this alliance and Samsung.

SK Hynix announced on April 19th that the company has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4, or the sixth generation of the HBM family, slated to be mass produced from 2026, through this initiative.

Looking at Samsung’s developments in the HBM, Samsung Electronics successfully developed the industry’s first highest-capacity 12-layer HBM3E in February, attempting to regain market dominance. In the second quarter, along with the 8-layer product, it will supply to Nvidia. The next goal is to launch the 16-layer HBM4.

Per TrendForce’s data, the three major HBM manufacturers held market shares are as follows: In 2023, SK Hynix and Samsung each held around 47.5%, while Micron’s share was roughly 5%. Still, forecasts indicate that SK Hynix’s market share in 2024 will increase to 52.5%, while Samsung’s will decrease to 42.4%.

In line with the same report from Business Korea, despite the decline in foundry demand, Samsung Electronics and SK Hynix’s profit prospects are expected to improve compared to last year.

As per estimates cited in the report from investment institutions, SK Hynix’s first-quarter revenue is expected to reach 12.1021 trillion won, with an operating profit of 1.7654 trillion won, and the operating profit for the entire year of 2024 is expected to exceed 21 trillion won; Samsung Electronics’ DS division’s performance is improving, with the first-quarter operating profit expected to be between 700 billion and 1.8 trillion won, and the overall operating profit for 2024 is expected to be around 35 trillion won.

(Photo credit: SK Hynix)

Recently, according to sources from an official platform of Shanghai Construction No.4 (Group), Huahong Group has topped out the main building of FAB9 of the Huahong Manufacturing (Wuxi) project. This is reportedly the second phase project with a total construction area of about 530,000㎡, which is projected to construct a 12-inch characteristic process production line with a monthly capacity of 83,000 wafers.

It can be seen that the 12-inch wafer field is greeted by high enthusiasm. Previously, companies such as Renesas Electronics, PSMC, TSMC, and UMC have all announced plans to build new 12-inch fabs. As for China, as per earlier industry reports, 12-inch fabs scheduled to start production in 2024 include CR Micro, ZenSemi, and CanSemi, all located in Guangdong Province.

• Investment Enthusiasm in 12-Inch Fabs Unabated

On April 11, Renesas officially restarted its previously closed factory in Kofu. It was announced in 2022 that Renesas would invest JPY 90 billion to convert the plant into a 12-inch fab in a bid to meet the increasing demand in the power semiconductor sector.

The fab has a cleanroom with an area of 18,000㎡, and it will start mass production of IGBTs, power MOSFETs, and other power devices in 2025, which is expected to double Renesas’ overall power semiconductor capacity.

On March 13, PSMC and India-based Tata Group held a groundbreaking ceremony for their joint 12-inch fab. The fab comes with a total investment of INR 910 billion (Around USD 11 billion), which is estimated to produce a monthly capacity of 50,000 wafers, covering various mature nodes such as 28nm, 40nm, 55nm, 90nm, and 110nm.

On February 24, TSMC’s Japan Kumamoto fab (JASM) was officially opened, marking TSMC’s first plant (Fab23) in Japan. TrendForce stated that the plant will possess a total capacity of up to 40~50Kwpm in the future, with the process mainly focusing on 22/28nm and a small amount of 12/16nm. This will pave the way for developing the main process of the Kumamoto Fab2 later.

Previously, TSMC had announced that in response to customer demand growth, construction of JASM’s second fab in Japan is planned to commence at the end of 2024 and start operation in late 2027. Media reports stated that TSMC would invest JPY 2 trillion in the second fab in Kumamoto, which will adopt advanced processes of 6nm and 7nm. The monthly total capacity of 12-inch wafers in JASM Kumamoto fab is expected to exceed 100,000 pieces in the future.

In January, it was reported that UMC’s new fab in Singapore is scheduled to complete construction by mid-2024 and start mass production in early 2025. UMC said that to meet the demand for capacity construction, its board of directors approved a capital budget execution proposal of USD 39.8 million. The first phase of the new fab, with a total investment of USD 5 billion, is expected to deliver a monthly capacity of 30,000 wafers, providing 22/28nm processes.

UMC has been operating the 12-inch fab in Singapore for over 20 years. In February 2022, UMC’s board of directors approved the plan to expand a new advanced fab in the Fab12i area in Singapore. At that time, UMC expected the new fab to start mass production in late 2024, but the latest news indicates that the date of mass production will be in early 2025.

• Several Guangdong-Based 12-Inch Fabs Set to Start Production in 2024

According to a local official report from Zengcheng, Guangdong, ZenSemi held a lithography machine introduction ceremony for the project of 12-inch advanced intelligent sensors and characteristic process wafers mass production lines, marking that the project has smoothly entered the debugging and production preparation phase.

It is reported that the first phase of the project covers an area of 370 acres, with a planned investment of CNY 37 billion. It is expected to start production in June 2024, with the first batch of high-yield products scheduled to be completed in late December and delivered to customers.

According to official information from CanSemi, the third phase of CanSemi’s project will establish a 12-inch integrated circuit analog characteristic process production line with a capacity of 40,000 wafers per month. Currently, the first and second phases have been put into production successively, and the company are accelerating the construction of the third phase project, striving to achieve a fixed asset investment of over CNY 4 billion in 2024 and ensure the third phase to complete construction and start production in 2024.

According to the Wechat Account “Binhai Baoan”, Huahong’ 12-inch characteristic process integrated circuit production line project is also expected to start production this year.

It is reported that the first phase of Huahong’ 12-inch power chip production line project has a total investment of CNY  22 billion, with a total construction area of 238,000㎡, and an annual production capacity of 480,000 wafers after completion. The products will mainly be used in automotive electronics, new energy, industrial control, consumer electronics, and other fields.

As per stats from Wechat Account “Global Semiconductor Observation”, there are currently 31 operating 12-inch fabs in China (Inclusive of under-construction 12-inch fixed-capacity fabs), with a total monthly capacity of approximately 1.189 million wafers.

Compared with the planned monthly capacity of 2.17 million wafers, the capacity utilization rate of these fabs is close to 54.48%, indicating significant expansion potential. Considering construction and future planning, it is estimated that China will add 24 new 12-inch fabs in the next five years, with a planned monthly capacity of 2.223 million wafers.

Assuming all planned 12-inch foundries achieve full production, the total monthly capacity of 12-inch wafers in China will exceed 4.14 million wafers in late 2026, representing a 248.19% increase in capacity utilization compared to the present.

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(Photo credit: TSMC)

Apple has released its supply chain list for the 2023 fiscal year, with notable changes compared to the 2022 list. According to a report from CNA, Major IC substrate manufacturer Nan Ya PCB has returned to Apple’s supply chain list, while Nanya Technology, Lotes, Novatek are no longer included. TSMC, Foxconn, Advanced Semiconductor Engineering (ASE), Pegatron, Compal, Wistron, and YAGEO remain part of Apple’s supply chain.

Apple’s 2023 fiscal year supply chain list covers approximately 98% of the materials, manufacturing, and assembly related to Apple products globally.

Compared to the 2022 supply chain list, for Foxconn, the updated list shows manufacturing locations for Apple products in Guangdong, Henan, Jiangsu, Shaanxi, Sichuan, and Zhejiang provinces in China, with the addition of Jiangxi while Hubei continues to be excluded. In other global regions, locations in Amazonas and Sao Paulo in Brazil, as well as California in the United States, are not included in the current list. However, locations in Tamil Nadu, India, and Bac Giang province, Vietnam, remain on the list.

For ASE, related locations include Jiangsu and Shanghai in China, Yamagata Prefecture in Japan, Taiwan, and Hai Phong City in Vietnam, with Gyeonggi-do in South Korea and Singapore continuing to be excluded.

Notably, companies including FPGA designer Lattice Semiconductor’s facility in Taiwan, Nanya’s facilities in Jiangsu and Taiwan, Lotes Terminal’s facility in Guangdong, Novatek Microelectronics and Taiwanese company Triotek Technology Incorporated are no longer parts of Apple’s supply chain for the fiscal year 2023.

On the other hand, major IC substrate manufacturer Nan Ya PCB, with facilities in Jiangsu, China, and Taiwan, has returned to Apple’s supply chain list. Golden Arrow Printing Company, with locations in Jiangsu, China, and Henan Province, Vietnam, is a new addition to Apple’s supply chain list.

Regarding Taiwanese companies that were first included in Apple’s supply chain list in 2022, including Platinum Optics Technology Incorporated, Primax Electronics Limited with locations in Guangdong, Radiant Opto-Electronics Corporation with locations in Guangdong and Jiangsu, Trinseo in Taiwan, and Winbond Electronics Corporation, these companies remain on Apple’s supply chain list for the 2023 fiscal year.

Furthermore, major Taiwanese companies such as TSMC, Catcher, Foxlink, Compal, Compeq, Delta Electronics, Largan Precision, Lite-On Technology Corporation, Pegatron, Shin Zu Shing, TXC Corporation, Unimicron Technology Corporation, Unitech, Wistron, and YAGEO continue to be included in Apple’s supply chain list.

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(Photo credit: Apple)

South Korean memory giant SK Hynix announced today that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4, or the sixth generation of the HBM family, slated to be mass produced from 2026, through this initiative.

SK Hynix said the collaboration between the global leader in the AI memory space and TSMC, a top global logic foundry, will lead to more innovations in HBM technology. The collaboration is also expected to enable breakthroughs in memory performance through trilateral collaboration between product design, foundry, and memory provider.

The two companies will first focus on improving the performance of the base die that is mounted at the very bottom of the HBM package. HBM is made by stacking a core DRAM die on top of a base die that features TSV technology, and vertically connecting a fixed number of layers in the DRAM stack to the core die with TSV into an HBM package. The base die located at the bottom is connected to the GPU, which controls the HBM.

SK Hynix has used a proprietary technology to make base dies up to HBM3E, but plans to adopt TSMC’s advanced logic process for HBM4’s base die so additional functionality can be packed into limited space. That also helps SK hynix produce customized HBM that meets a wide range of customer demand for performance and power efficiency.

SK Hynix and TSMC also agreed to collaborate to optimize the integration of SK Hynix’s HBM and TSMC’s CoWoS technology, while cooperating in responding to common customers’ requests related to HBM.

“We expect a strong partnership with TSMC to help accelerate our efforts for open collaboration with our customers and develop the industry’s best-performing HBM4,” said Justin Kim, President and the Head of AI Infra, at SK Hynix. “With this cooperation in place, we will strengthen our market leadership as the total AI memory provider further by beefing up competitiveness in the space of the custom memory platform.” 

“TSMC and SK Hynix have already established a strong partnership over the years. We’ve worked together in integrating the most advanced logic and state-of-the art HBM in providing the world’s leading AI solutions,” said Dr. Kevin Zhang, Senior Vice President of TSMC’s Business Development and Overseas Operations Office, and Deputy Co-Chief Operating Officer. “Looking ahead to the next-generation HBM4, we’re confident that we will continue to work closely in delivering the best-integrated solutions to unlock new AI innovations for our common customers.”

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(Photo credit: SK Hynix)

Following the magnitude 7.2 earthquake in Taiwan on April 3rd, all of TSMC’s fabs resumed normal operations within three days. According to a report from Commercial Times, TSMC expects to recognize earthquake-related losses of approximately NTD 3 billion (roughly USD 92.1 million) in the second quarter after deducting insurance claims.

During its earnings call on April 18th, TSMC President C.C. Wei expressed gratitude for the dedication and hard work of all employees and supplier partners. He also thanked customers for their understanding and support, stating that TSMC would compensate for production losses in the second quarter.

C.C. Wei stated that during this earthquake, the maximum intensity experienced at TSMC’s fabs was level 5. Immediately following the earthquake, TSMC activated safety measures and occupational health systems at the fabs. All personnel were safe, and through everyone’s tireless efforts, plant operations were swiftly restored.

Due to TSMC’s extensive experience and capabilities in earthquake response and disaster prevention, coupled with regular safety drills, the overall equipment recovery rate of TSMC’s fabs exceeded 70% within 10 hours of the earthquake and was fully restored before the end of the third day following the earthquake. There were no power outages or structural damages at TSMC’s fabs, including critical equipment such as extreme ultraviolet (EUV) exposure machines, all of which remained undamaged.

During this earthquake, although TSMC experienced a certain quantity of wafers in production that were affected and had to be scrapped, it is anticipated that most of the production losses will be recovered in the second quarter, resulting in minimal impact on second-quarter revenues.

TSMC expects the overall impact of the earthquake to decrease its second-quarter gross margin by approximately 50 basis points, primarily due to losses related to wafer scrap and material consumption.

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• [News] Taiwan Hit by 7.2 Magnitude Earthquake: TSMC and Other Semiconductor, Panel Supply Chain Updates

(Photo credit: TSMC)