According to a report from Economic Daily News, TSMC's advanced packaging platform SoIC is said to have secured another heavyweight customer, with Apple expected to adopt the technology in 2025. If confirmed, Apple will join AMD as a major client expanding its use of TSMC's SoIC . TSMC has categ...

As semiconductor manufacturing enters the Angstrom Era, there have been significant adjustments in architecture and circuit design. To free up more surface area on chips, moving power delivery to the backside has become a mainstream consensus, making the Backside Power Delivery Network (BSPDN) the...

As semiconductor companies led by TSMC accelerate their pace for capacity expansion, benefiting the local supply chain, industry electricity consumption has emerged as a tough challenge for Taiwan. According to the latest report by the Economic Daily News, Taiwan can only accommodate 20 more large p...

Apple is reportedly pushing the boundaries of AI with the upcoming iPhone 16 series, which is expected to have computational power that surpasses industry expectations. According to a report from Economic Daily News, it has suggested that Apple is developing the A18 chip for this year's iPhone 16 mo...

Semiconductor equipment giant ASML plans to launch Hyper-NA Extreme Ultraviolet (EUV) machines by 2030, signaling the advent of the Angstrom era for semiconductor processes below 1 nanometer. However, according to a report from The Chosun Daily, the high cost of this equipment may cause TSMC, Samsu...