TSMC: Steady Progress in Advanced Nodes, Reduced Revenue Share from Mature Nodes   On November 26, TSMC held an equipment installation ceremony for its new 2nm fab in Kaohsiung, marking the company's first 12-inch wafer fab in Kaohsiung, Taiwan. This milestone signals TSMC's transition fr...

While NVIDIA may be better known for its latest advancements in AI accelerators such as Blackwell, the tech giant’s automotive chips are expected to seen explosive growth in 2025, with TSMC and IC design house MediaTek poised to seize this business opportunity, according to a report from Commercia...

As demand for artificial intelligence continues to surge, the industry's appetite for high-performance computing chips has grown increasingly intense. According to a report by the Commercial Times, NVIDIA’s next-generation Blackwell architecture chip, the GB200, has encountered new technical hurdl...

The U.S. government’s efforts to boost domestic semiconductor manufacturing continue to gain momentum. According to a report from TechNews, information submitted by TSMC to the U.S. Department of Commerce reveals that the 2nm process is expected to begin production in the U.S. as early as 2028. ...

According to a report from TechNews, citing Tom’s Hardware, at its European Open Innovation Platform (OIP) Forum, TSMC announced that its ultra-large chip-on-wafer-on-substrate (CoWoS) packaging technology would be certified by 2027, featuring 9x reticle sizes and supporting up to 12 stacks of HBM...