The US-China tech war continues to escalate, as reported by the Financial Times (FT). Beijing has reportedly instructed official institutions in China to refrain from using PCs and servers equipped with microprocessors from Intel and AMD, as well as to reduce procurement of Microsoft Windows operat...

As the demand for AI is becoming urgent, according to industry sources cited by the ChinaTimes News, TSMC's Fab20 P1 plant in Hsinchu's Baoshan area will undergo equipment installation engineering in April to warm up for mass production of the GAA (gate-all-around) architecture. Reportedly, it is...

NVIDIA unveiled its Blackwell architecture and the touted powerhouse AI chip GB200 at GTC 2024 held in San Jose, California, on March 19th. Manufactured using TSMC's 4-nanometer (4NP) process, it is expected to ship later this year. According to a report from TechNews, TSMC's CoWoS technology com...

As TSMC and Intel slow down their plans for building fabs in the United States, the supply chain, according to a report from Nikkei Asia, is also said to delay in following suit, with semiconductor material suppliers like Topco Scientific, LCY Chemical, and Chang Chun Group among those named. Per...

Driven by the AI chip wave, "advanced packaging" emerges as the hottest technology in the semiconductor industry. Its significance extends beyond computational power demands, as the escalating cost of semiconductor processes and the limits of Moore's Law make the "integration capability" of advanced...