Following TSMC's announcement of investing USD 20 billion to build two plants in Kumamoto, Japan, industry sources cited by a report from Commercial Times has indicated that the major global semiconductor assembly and testing provider, ASE Group, is in discussions with the Japanese government to fin...

TSMC unveiled its angstrom-class A16 advanced process during the Company’s 2024 North America Technology Symposium on April 25, set to be mass-produced in 2026. Not only is this earlier than competitors like Intel's 14A and Samsung's SF14, both slated for 2027 production, but TSMC also emphasized ...

Henri Richard, head of Rapidus Design Solutions, the US subsidiary of Japan's semiconductor foundry startup Rapidus, and former Chief Marketing Officer at processor giant AMD, indicates that Rapidus aims to position itself as a filler of market gaps during the interview with global media The Regis...

TSMC today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading nanoshe...

According to reports from global media outlets like MacRumors and Wccftech on April 23rd, Apple is said to be developing its first in-house AI processor for PCs, the M4 chip, and is also working on a self-developed AI server processor using TSMC's 3-nanometer process, with plans for mass productio...