China, Taiwan, and South Korea’s foundry price war continues to heat up. Rumors of price reductions are circulating in the foundry industry, Chinese foundries allegedly lowering their tape out prices, attracting Taiwanese IC design companies to switch their orders.

Companies including Samsung, GlobalFoundries, UMC, and PSMC have reportedly seen customers cancel orders in favor of these Chinese foundries.

According to reports from IJIWEI, China’s SMIC, Huahong Group, and Nexchip began lowering their foundry service prices to Taiwanese IC design companies last year to secure new orders. Many Taiwanese IC design companies have been enticed by these lower prices, prompting them to shift their orders to Chinese foundries. As a result, companies like Samsung, GlobalFoundries, UMC, and PSMC have witnessed customers canceling orders in favor of Chinese manufacturers.

Due to the mature manufacturing processes in China, unaffected by US export restrictions, the lowered wafer fabrication costs have become attractive to Taiwanese IC design companies seeking to enhance their cost competitiveness.

Reports also indicate that this competitive pressure has forced Taiwan’s foundries, UMC and PSMC, to follow suit by reducing their prices. UMC has lowered its 12-inch wafer foundry services by an average of 10-15%, while its 8-inch wafer services have seen an average price reduction of 20%. These price adjustments took effect in the fourth quarter of 2023.

Earlier reports from TechNews had already highlighted that, due to the sluggish semiconductor market conditions in 2023, both China and South Korea aggressively reduced prices to secure orders, with price reductions of up to 20-30% observed in 8-inch and 12-inch mature processes. Taiwanese foundries also made concessions in terms of pricing.

Taiwan’s leading foundry, TSMC, had already initiated pricing concessions in 2023, mainly related to mask costs rather than wafer fabrication. It was reported that these concessions primarily applied to the 7nm process and were dependent on order volumes.

Samsung Foundry, which had previously remained inactive, also adopted a price reduction strategy in the first quarter of this year, offering discounts ranging from 5-15% and indicating a willingness to negotiate.

Looking at the global semiconductor foundry landscape, data released by TrendForce in 2023 showed that Taiwan accounted for approximately 46% of the world’s wafer fabrication capacity, followed by China at 26%, South Korea at 12%, the United States at 6%, and Japan at 2%. However, due to active efforts by China, the United States, and other countries to increase their local capacity shares, by 2027, Taiwan and South Korea’s capacity shares are expected to converge to approximately 41% and 10%, respectively.

Read More: 

• [News] Competing with TSMC? Samsung Foundry Follows Price Cuts, Offering Discounts Up to 15%

The global foundry advanced process battle is reigniting, as reported by the Commercial Times. TSMC’s 2-nanometer process at the Baoshan P1 wafer fab in Hsinchu is set to commence equipment installation as early as April, incorporating a new Gate-All-Around (GAA) transistor architecture and aiming for mass production in 2025.

Additionally, expansion plans for Baoshan P2 and the Kaohsiung fab are projected to join in 2025, with evaluations underway for Phase 2 in the Central Taiwan Science Park. The competition with Samsung and Intel in the most advanced process is intensifying.

Semiconductor industry sources note the ongoing progress in global foundry advanced processes, with Samsung entering GAA architecture early at 3 nanometers, though facing yield challenges, while Intel anticipates mass production of its RibbonFET architecture at 20A this year.

In response to fierce competition, TSMC must accelerate its pace. The ‘Gate-All-Around’ (GAA) technology is a critical factor determining whether chip processing power will double within 1.5 to 2 years.

As per the report, Samsung’s attempt to lead in the 3-nanometer chip segment, transitioning from traditional FinFET, has faced stability issues in yield, hampering customer adoption, and giving TSMC confidence in its 3-nanometer progress. This also highlights the increased complexity in transitioning from 2D to 3D chip designs with GAA transistor architecture.

Furthermore, Intel is intensifying its efforts to catch up, planning to launch Intel 20A in the first half of the year and Intel 18A in the second half. However, it is speculated that Intel 20A will be exclusively used for Intel’s own products, maintaining a close collaboration with TSMC.

TSMC, adopting a cautious approach, benefits from a more advantageous cost structure by minimizing changes in production tools within the same process technology and manufacturing flow. For customers, altering designs during advanced process development incurs significant time and economic costs.

Supply chain sources reveal that TSMC finalized various parameters for its 2-nanometer process at the end of last year, confirming specialty gases and equipment. Contracts are gradually being signed, with equipment installation at the Baoshan P1 fab scheduled to commence in April. Equipment industry sources suggest that TSMC’s process advancement is progressing rapidly as expected, speculating that there will be updates on the Baoshan P2 fab later this year.

(Image: TSMC)

According to a report by TechNews, Taiwan has introduced its largest-ever investment deduction incentives under the “Statute for Industrial Innovation,” often referred to as the “Taiwanese Chip Act.” Articles 10-2 and 72 of the statute came into effect, and the Ministry of Economic Affairs announced that it would accept company applications from February 1 to May 31 this year.

The Ministry of Economic Affairs stated that applications for deductions would be accepted starting February this year. The provided tax incentives include a 25% deduction for research and development expenses and a 5% deduction for expenditures on acquiring new eqipment for advanced processes, all of which can be deducted from the current year’s corporate income tax.

Eligibility criteria include companies with research and development expenses of at least NT$6 billion, a research and development density of 6%, and expenditures of NT$10 billion for the purchase of equipment for advanced processes, with no restrictions on industry category.

The Ministry of Economic Affairs emphasized that as the parent law already specifies an effective tax rate of 12% for the fiscal year 112 and a threshold of 15% from the fiscal year 113 onwards, this measure aims to encourage businesses that do not meet these tax rate qualifications to strive for them and become eligible for tax incentives.

A review panel will be formed to assess whether applying companies meet the criteria for a critical position in the international supply chain and other qualification requirements.

The Ministry of Economic Affairs shared that the application period for Article 10-2 of the Statute for Industrial Innovation is from February 1 to May 31 this year. Companies are required to provide explanatory documents and supporting evidence, including data on products, international market share, rankings, import-export trade, and other statistics, serving as indicators for the assessment of technological innovation and critical positions.

According to the financial reports of publicly listed companies in 2022, including TSMC, MediaTek, Realtek, Novatek, Delta Electronics, Nanya Technology, Phison and Winbond, their research and development expenses and research and development density all meet the application thresholds.

(Image: TSMC)

According to Commercial Times, TSMC, the leading semiconductor foundry, will hold its investor conference on the 18th. Market attention will be focused on eight key questions, including the 2024 full-year revenue forecast, advanced process development, and progress in overseas facility expansion.

Key points of interest for investors include: 1. TSMC’s 2024 full-year gross margin trends and changes in the first and second quarter gross margins. 2. Intel’s aggressive pursuit of advanced processes and how TSMC views it. 3. Chairman Mark Liu’s announcement of retirement in 2024 and whether TSMC’s overseas expansion plans will change. 4. Strategies for expanding advanced packaging production capacity. 5. Annual capital expenditures. 6. Views on the semiconductor industry’s recovery. 7. Trends in utilization rates for each process. 8. Full-year revenue outlook.

The market is closely watching TSMC’s first-quarter gross margin. Morgan Stanley semiconductor industry analyst Charlie Chan pointed out that due to the price reduction for 3-nanometer process foundry services provided to Apple, coupled with the recent appreciation of the New Taiwan Dollar against the U.S. Dollar and accelerated depreciation, TSMC’s gross margin for 2024 is under pressure.

According to industry sources, TSMC may slightly slow down the transition from 5-nanometer to 3-nanometer process equipment this quarter. The lowest point in the annual gross margin may fall in the second quarter, rather than the originally estimated first quarter, meaning that TSMC’s quarterly gross margin will not experience a cliff-like plunge.

As for TSMC’s full-year revenue outlook, after Goldman Sachs and UBS Securities expressed optimism about TSMC’s revenue growth exceeding 20% for the year, JPMorgan Securities also noted that, driven by inventory replenishment, AI demand, and the expansion of the 3-nanometer process, TSMC’s revenue is expected to grow by 20% in 2024. The acceleration from AI accelerators and system-on-chip (SoC) for smartphones will lead to better-than-expected capacity utilization rates for the 5-nanometer and 4-nanometer processes.

(Image: TSMC)

Various countries are actively developing their semiconductor industries, with Taiwan’s semiconductor foundries, including TSMC, UMC, and PSMC, becoming prime targets for local manufacturing facilities. TSMC has established plants in the United States, Germany, and Japan, while PSMC, in addition to its facility in Miyagi-ken, Japan, has recently announced plans to assist India in building a factory.

However, for these Taiwanese semiconductor foundries, expanding overseas may not always prove to be a economical choice.

According to Taiwan’s Economic Daily News, PSMC Chairman Frank Huang revealed that 7 to 8 countries have invited the company to establish manufacturing facilities in their respective regions. However, the costs in these countries are higher than those in Taiwan.

Huang pointed out that, based on the data they have, the cost of building a fab in Japan is 1.5 times higher than in Taiwan, with construction costs being 2.5 times higher and operational costs 50% more expensive than in Taiwan. It would take 7 to 8 years for the combined construction and operation to become profitable, meaning the factory would only start making money three years after its establishment. In contrast, PSMC’s Fab P5 in Tongluo Science Park is expected to break even this year.

PSMC had already disclosed plans to assist India in technology transfer for building a fab in early 2023. Huang explained that because South Korea and the United States are unwilling to teach others how to make semiconductors, neither TSMC nor UMC are offering such assistance, leaving PSMC as the go-to option for those seeking guidance in semiconductor manufacturing.

The countries reported to have sought PSMC’s assistance in building fab include Japan, Vietnam, Thailand, India, Saudi Arabia, France, Poland, and Lithuania.
According to TrendForce research, PSMC is the third-largest semiconductor foundry in Taiwan and ranks 10th globally. It announced its investment in a 12-inch factory in Miyagi-ken, Japan, at the end of 2023.

Similarly, TSMC, the leading foundry based in Taiwan, faces similar challenges when expanding overseas. In early 2023, TSMC executives stated during an earnings conference that due to factors such as labor costs, permits, regulatory compliance, and rising living prices, the cost of setting up a plant in the United States is at least four times higher than in Taiwan.

However, beneath the economic considerations, geopolitical factors play a significant role in these decisions. The ongoing regional shift in the semiconductor industry supply chain is inevitable in the current geopolitical climate.

(Image: PSMC)