According to a report from Wccftech, Samsung Electronics may consider partnering with external foundries to produce its Exynos 2500 processor for the first time. The Wccftech report, citing Korean media outlet The Bell, notes that while TSMC is not explicitly mentioned, it remains the only alternati...

United Microelectronics Corporation (UMC) is making significant strides in the advanced packaging sector, breaking new ground in a market traditionally dominated by TSMC. According to a report by Economic Daily News, UMC has secured a major advanced packaging order from Qualcomm for high-performance...

With its N2 (2nm-class) node beginning mass production in the latter half of 2025, TSMC revealed more details about it at the IEEE International Electron Device Meeting (IEDM) a couple of days ago. According to IEEE Spectrum and Tom’s Hardware, TSMC's new 2nm technology delivers up to 15% faster p...

According to a report by Economic Daily News, TSMC is riding the wave of AI and high-performance computing (HPC) applications, with its USD-denominated revenue expected to reach record highs in Q4 2024 and throughout the year. Recently, rush orders have surged as customers anticipate tighter U.S. re...

According to a report from Commercial Times, TSMC is actively expanding its advanced packaging facilities in Taiwan. With the Tainan facility (AP8) it acquired earlier from Innolux starting small-scale production by the end of 2025, TSMC's CoWoS capacity is expected to triple, rising to 90,000 wafe...