Germany is currently caught in a budget dispute that led to the rejection of a planned multi-billion-euro official subsidy for semiconductor companies. Sources suggest that if the German government reduces the initially committed subsidy, TSMC might need to reopen discussions on its investment in a ...

The highly anticipated 18th International Microsystems, Packaging, Assembly, and Circuits Technology Conference, also known as IMPACT 2023, took place with grandeur from October 25th to 27th at Hall 1 of Taipei Nangang Exhibition Center. This prestigious event was co-organized by leading institution...

According to TechNews' report, after a prolonged period of price suppression in the mobile panel market, there has been an upswing in demand since the end of the second quarter, as customer inventories have reached a turning point. The report further quoted industry sources, stating that the incr...

According to a report from Taiwan's Commercial Times, industry experts assert that Silicon Photonics (SiPh) is poised to revolutionize the cloud industry as communication transmission speeds surge beyond 1.6 Tbps. Utilizing Co-Packaged Optics (CPO) for integration, SiPh combines optical components a...

The AI landscape witnesses a robust surge with the consecutive launches of AMD's "Instinct MI300" series AI chips and NVIDIA's upcoming "B100" GPU structure. This wave of innovation propels a flourishing demand for AI-related Outsourced Semiconductor Assembly And Test Services (OSAT), surpassing in...