TSMC


2023-09-05

[News] Taiwan Micron Focuses on HBM Advanced Process and Packaging

According to Taiwan's TechNews report, Lu Donghui, Chairman of Micron Technology Taiwan, stated that in response to the growing demand in the AI market, Micron Technology Taiwan will continue to invest in advanced processes and packaging technologies to produce High Bandwidth Memory (HBM) products. ...

2023-09-04

[News] Chiang Shang-yi, Former TSMC Co-COO, Shares China Experience and CoWoS Development

According to Taiwan's TechNews report, Chiang Shang-yi, former TSMC Co-COO and current Chief Semiconductor Strategist at Foxconn, shared insights during a Taiwan Television interview. He discussed his past role at TSMC, the potential impact of U.S. export restrictions on China's semiconductor develo...

2023-09-04

[News] Amid Uncertain Market, TSMC to Avoid Supplier Price Cuts Next Year

According to a report from Taiwan's TechNews, as we approach the fourth quarter, which marks the peak period for negotiations between the semiconductor manufacturing leader TSMC and its suppliers, the supply chain is indicating that TSMC is expected to follow a similar approach to that of 2022. This...

2023-09-01

[News] Rumored AI Chip Demand Spurs Price Hikes at TSMC, UMC, ASE

TSMC's CoWoS advanced packaging capacity shortage is causing limitations in NVIDIA's AI chip output. Reports are emerging that NVIDIA is willing to pay a premium for alternative manufacturing capacity outside of TSMC, setting off a surge in massive overflow orders. UMC, the supplier of interposer ma...

2023-08-31

[News] Goldman Sachs: TSMC to Win Big with Intel’s Increased Outsourcing

According to a report by Taiwan's Commercial Times, Goldman Sachs Securities has noted that Intel has been consistently grappling with process upgrade delays since the 10-nanometer fabrication process. Recently, the company has decided to establish a foundry-like relationship between its manufacturi...

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