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2024-08-06

[News] ChangXin Memory Technologies in China Has Reportedly Begun Mass Production of HBM2

According to a report from Tom’s Hardware citing industry sources, it’s indicated that Chinese memory giant ChangXin Memory Technologies (CXMT) has started mass production of HBM2. If confirmed, this is approximately two years ahead of the expected timeline, although the yield rate for HBM2 is s...

2024-05-29

[News] Nanya Technology Chairman Names 10nm 1B Process as Key Expansion Focus for the Year

DRAM giant Nanya Technology held its shareholder meeting earlier today, during which Chairman Chia-Chau Wu reported on the company's operations. According to a report from UDN, He mentioned that despite challenges such as unfavorable market conditions, geopolitical tensions, and the US-China trade c...

2023-08-22

TSMC’s CoWoS Dominance: Amkor, ASE, JCET’s Response

In response to the demands of high-performance computing, AI, 5G, and other applications, the shift towards chiplet and the incorporation of HBM memory has become inevitable for advanced chips. As a result, packaging has transitioned from 2D to 2.5D and 3D formats. With chip manufacturing advanci...

2023-08-08

An In-Depth Explanation of Advanced Packaging Technology: CoWoS

Over the past few decades, semiconductor manufacturing technology has evolved from the 10,000nm process in 1971 to the 3nm process in 2022, driven by the need to increase the number of transistors on chips for enhanced computational performance. However, as applications like artificial intelligence ...

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