News
China has been in the spotlight lately with its breakthroughs in semiconductors. Following the buzz that SMIC is said to produce 5nm chips for Huawei this year, Xiaomi is rumored to have taped out its first 3nm SoC. China’s efforts can also been seen by the surge of semiconductor patent applications, with the country’s filing in 2023-24 soaring by 42%, according to a report by The Register.
Citing the data from IP firm Mathys & Squire, the report notes that there is a 22% global increase in semiconductor patent applications, rising from 66,416 in 2022-23 to 80,892 in 2023-24.
It is worth noting that China’s semiconductor sector is rapidly advancing in response to U.S. export controls, while its semiconductor patent applications during 2023-24 showed the strongest growth among all regions, rising from 32,840 to 46,591 with a 42% year-over-year increase, according to The Register.
However, China’s surge in patent applications is not solely influenced by geopolitical factors. AI accelerators and high-performance chips have become highly sought after amid the AI boom, leading chipmakers around the world, including those in China, to rush to file patents for the next breakthrough in AI hardware, the report states.
An expert from Mathys & Squire cited by the report states that as the U.S.-China chip war intensifies, export restrictions are prompting China to increase its investment in domestic semiconductor research and development, and this is now evident in their rising patent applications.
On the other hand, the U.S. is also making great strides in semiconductors. The data from IP firm Mathys & Squire reveals that the hometown of chip giants Intel, Qualcomm and NVIDIA experienced a 9 percent increase in patent filings, reaching 21,269 in 2023-24.
With government policies channeling funds into domestic chip production—TSMC’s Arizona plant being a notable example—the U.S. is eager to strengthen its supply chain while intensifying its research and development initiatives, which is in line with the trend, the report suggests.
Nevertheless, China is still years behind the most cutting-edge chip technologies, the report points out. For instance, the report notes that the CPU released by Chinese chip firm Loongson last week, 3B6600, though claiming to rival 7nm x86 processors, would be similar to match the performance of AMD and Intel’s products from five years ago.
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According to a report from Reuters, the U.S. government is finalizing regulations that will prohibit investments in AI in China, as indicated by a recent government update. The regulation will restrict specific outbound investments to China in areas such as AI, semiconductors, microelectronics, and quantum computing.
According to the report, the rule is currently under review at the Office of Management and Budget, suggesting that it is expected to be released within the next week or so.
The rules will reportedly require U.S. investors to notify the Treasury Department about certain investments in AI and other sensitive technologies in China.
The report highlighted that the rules are based on President Joe Biden’s executive order from August 2023, aimed at safeguarding American knowledge and preventing its application in China’s military advancements.
According to the proposals released last year, the U.S. Treasury Department highlighted that the military, intelligence, surveillance, and cyber-enabled uses of these technologies and products pose risks to U.S. national security, particularly when developed by countries of concern such as the PRC.
Citing former Treasury official Laura Black, the report suggested that the rule is expected to be released before the U.S. election. Black also noted that the Treasury office responsible for overseeing regulations typically allows for a minimum 30-day period before the actual implementation of the rule.
According to the report, the Treasury Department released proposed rules, including some exceptions, and invited public comments in June. Black expected that the final rules will provide further clarity on the scope of coverage for AI and the thresholds for limited partners.
Additionally, the report noted that the proposed exceptions include publicly traded securities such as index funds and mutual funds, along with certain limited partnership investments and specific syndicated debt financings.
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News
China has taken steps to assert state ownership over its rare-earth materials necessary for semiconductor production by enacting a regulation that came into effect on October 1st. In response to China’s export restrictions, the U.S. Department of Defense agency DARPA (Defense Advanced Research Projects Agency) has asked Raytheon to develop new types of semiconductors that do not rely on materials controlled by China, according to Tom’s Hardware.
Wide-bandgap semiconductor materials such as gallium nitride (GaN) are used in the production of advanced power chips and radio frequency amplifiers, and China controls a significant portion of the global gallium supply. According to a report from Tom’s Hardware, China’s recent export restrictions on gallium pose potential risks to American national security. To counter this challenge, the U.S. DARPA has asked Raytheon to develop synthetic diamond and aluminum nitride (AIN) semiconductors.
According to Tom’s Hardware, while GaN is a leading material for high-power and high-frequency semiconductors with a bandgap of 3.4 eV, synthetic diamond has the potential to surpass GaN’s capabilities with its bandgap of around 5.5 eV. However, synthetic diamond is still an emerging semiconductor material, and there are many challenges to overcome for mass production. Aluminum nitride features an even wider bandgap of about 6.2 eV.
As per the report from Tom’s Hardware, Raytheon aims to develop diamond and aluminum nitride semiconductors for both current and next-generation radar and communication systems, including radio frequency switches, limiters, and amplifiers that can be integrated into high-speed weapon systems. However, Raytheon has not yet developed suitable semiconductors.
According to the press release from Raytheon, during phase one of the contract, the Raytheon Advanced Technology team will develop diamond and aluminum nitride semiconductor films and their integration onto electronic devices. Phase two will focus on optimizing and maturing the diamond and aluminum nitride technology onto larger diameter wafers for sensor applications.
Quoting from the press release, Colin Whelan, president of Advanced Technology at Raytheon, states that “this is a significant step forward that will once again revolutionize semiconductor technology.” He emphasizes that “Raytheon has extensive proven experience in developing similar materials, such as gallium arsenide and gallium nitride, for Department of Defense systems. By leveraging that pioneering history and our expertise in advanced microelectronics, we will work to advance these materials for future applications.”
(Photo credit: iStock)
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A few weeks ago, Intel is said to be seeking assistance from the U.S. government, as CEO Pat Gelsinger reportedly turned to Commerce Secretary Gina Raimondo to emphasize the significance of U.S. chip manufacturing. Now here’s the latest development: according to a report by Bloomberg, the U.S. House has passed a bill that exempts certain semiconductor manufacturing projects from federal permitting requirements, which is expected to benefit companies like Intel and TSMC.
According to Bloomberg, the move aims to alleviate concerns that environmental reviews and legal challenges could slow the construction of domestic chip plants.
The report notes that spurred by incentives from the 2022 Chips and Science Act, chipmakers have committed around USD 400 billion to build factories in the US. Companies such as Intel and TSMC are set to receive billions in funding from the act to support major projects nationwide. Other tech giants, including Micron, Samsung, SK hynix and GlobalFoundries, are also getting billions in U.S. subsidies.
However, many of the projects are facing delays. For instance, Intel’s Fab 52 and Fab 62 in Arizona are previously scheduled to be completed in 2024. However, the schedule may be reportedly delayed a bit, as the fabs are likely to begin operations later this year or in early 2025. The USD 20 billion project in Ohio, on the other hand, may be facing larger obstacles as Intel has delayed the plan after 2026 due to market downturns and delays in U.S. subsidies.
The pending awards, according to Bloomberg, currently require semiconductor construction sites to undergo National Environmental Policy Act (NEPA) reviews, a process that could last months or even years. Now it would be streamlined by the legislation passed on Monday.
The bill specifies three criteria for Chips Act-funded projects to qualify for a NEPA exemption, Bloomberg states.
First, projects must begin construction before the end of this year, a requirement that most major sites should be able to meet, except for a Micron’s project in New York, which has not yet met permitting requirements under the Clean Water Act and various state regulations, Bloomberg explains.
Second, projects that receive only loans—not direct grant funding—would be exempt from NEPA reviews, although this provision currently does not apply to any Chips Act incentive packages.
Finally, facilities would qualify for an exemption if grant funding constitutes less than 10% of project costs, a decrease from the previous threshold of 15% in an earlier version of the legislation, the report notes.
It is worth noting that the proposal, waiting for Biden’s nod, illustrates the dilemma the U.S. government is currently facing. For one thing, the U.S. authority is eager to expedite the construction of chip factories to reduce reliance on Asia, particularly Taiwan. On the other hand, the White House has set ambitious climate goals, and building semiconductor plants could complicate efforts to achieve these targets, according to Bloomberg.
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(Photo credit: Intel)
Insights
The U.S. non-farm payroll data for August is set to be released on September 6. Ahead of that, the ADP employment report, often referred to as the “mini-NFP,” was published on September 5. The report revealed that private-sector employment in the US rose by 99,000 jobs in August, significantly lower than the market expectation of 145,000, marking the lowest level since 2021 and signaling a further slowdown in the labor market. This has heightened speculations that the Federal Reserve might increase the scale of rate cuts.
The ISM Services PMI, which was released on the same day, presented a more optimistic picture. The August Services PMI came in at 51.5 (previously 51.4), slightly higher than the market expectation of 51.3, remaining in expansion territory for the second consecutive month.
Breaking down the sub-indices, the employment index fell to 50.2 (previously 51.1), in line with the ongoing labor market slowdown but still indicating growth. The new orders index rose to 53.0 (previously 52.4), and the supplier delivery time index increased to 49.6 (previously 47.6), reflecting continued strong demand for services. However, the business activity index dropped to 53.3 (previously 54.5), suggesting that high interest rates and costs are still exerting some negative pressure on business operations. Despite this, all indices remained in expansion, indicating that the overall services sector is still experiencing stable growth.
In the commentary from managers surveyed, industries with rising demand (such as finance, information, entertainment, and healthcare) reported continued improvement or strength in business activity. Conversely, sectors with declining demand (such as construction, utilities, and wholesale trade) cited high interest rates and cost pressures as factors weakening business activity. Some companies in these sectors are also conducting layoffs or reducing hiring. Overall, while the demand in the services sector is significantly stronger than in manufacturing, there are still signs of uneven recovery across industries.