TSMC's CoWoS advanced packaging capacity shortage is causing limitations in NVIDIA's AI chip output. Reports are emerging that NVIDIA is willing to pay a premium for alternative manufacturing capacity outside of TSMC, setting off a surge in massive overflow orders. UMC, the supplier of interposer ma...

According to a report from Taiwan's TechNews, NVIDIA has delivered impressive results in its latest financial report, coupled with an optimistic outlook for its financial projections. This demonstrates that the demand for AI remains robust for the coming quarters. Currently, NVIDIA's H100 and A100 c...

According to a report from Taiwan's Commercial Times, NVIDIA is aggressively establishing a non-TSMC CoWoS supply chain. Sources in the supply chain reveal that UMC is proactively expanding silicon interposer capacity, doubling it in advance, and now planning to further increase production by over t...

According to a report by Taiwan's Commercial Times, JPMorgan's latest analysis reveals that AI demand will remain robust in the second half of the year. Encouragingly, TSMC's CoWoS capacity expansion progress is set to exceed expectations, with production capacity projected to reach 28,000 to 30,000...

According to the news from Money UDN, amid a tough semiconductor market, once-stable long-term contracts for silicon wafer makers have turned uncertain. A major Taiwanese foundry seeks price cuts in upcoming contracts from a Japanese supplier. Intense negotiations are ongoing, potentially affecting ...