The US-China tech war continues to escalate, as reported by the Financial Times (FT). Beijing has reportedly instructed official institutions in China to refrain from using PCs and servers equipped with microprocessors from Intel and AMD, as well as to reduce procurement of Microsoft Windows operating systems and database software outside of China.

In response to these reports, both Microsoft and Intel have declined to comment, while AMD, China’s Ministry of Finance, Ministry of Industry and Information Technology, and the China Information Security Evaluation Center have not responded to requests for comment from FT reporters.

FT further reveals that Chinese authorities have requested state-owned enterprises to promote localization internally. Intel and AMD are the two major semiconductor giants in the United States, dominating nearly all global market shares of PC processors.

As both Intel and AMD are significant customers of TSMC’s advanced process nodes, this move is expected to influence TSMC’s future order status. Regarding China’s full-scale development of proprietary computer processors, its potential impact on ASIC-related companies in Taiwan remains to be seen.

As per Industry sources cited by the report, they have suggested that this move by Chinese authorities demonstrates their determination to strengthen local semiconductor autonomy and enhance manufacturing and design capabilities. On the manufacturing side, the focus remains on supporting SMIC, while chip design is primarily led by companies such as Huawei and Phytium.

Per the same report, following the release of new guidelines by China’s Ministry of Finance and Ministry of Industry and Information Technology on December 26th last year, officials have begun adhering to the latest standards for PC, laptop, and server procurement this year. They have mandated that government departments at the township level and above, as well as party organizations, must incorporate standards for purchasing “secure and trustworthy” processors and operating systems.

The China Information Technology Security Evaluation Center has published the first list of “safe and reliable” processors and operating systems, all of which are from Chinese enterprises.

Among the 18 approved processors are chips from Huawei and Phytium. Chinese processor manufacturers are utilizing a hybrid architecture combining Intel x86, Arm, and self-developed designs for chip production, while operating systems are sourced from open-source Linux software.

Prior to the speculated tightening of restrictions by China on the United States, a report from Bloomberg citing sources had already signaled that the US government is considering adding Chinese semiconductor companies linked to Huawei to a blacklist.

Currently, companies that have been listed on the entity list by the US Department of Commerce include Huawei, SMIC (Semiconductor Manufacturing International Corporation), and Shanghai Micro Electronics. Additionally, China’s other major memory manufacturer, Yangtze Memory Technology Corp, was added to this restriction list in 2022.

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• [News] US Government Considers Adding ChangXin Memory Technologies to Entity List, Imposing Further Sanctions on Chinese Firms
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(Photo credit: iStock)

According to Bloomberg citing sources, the US government is considering adding Chinese semiconductor companies linked to Huawei to a blacklist. This move comes after Huawei made significant breakthroughs in technology last year, indicating a potential escalation in US efforts to curb China’s ambitions in AI and semiconductors.

As per a report from the Semiconductor Industry Association (SIA), most of the potentially affected Chinese entities are identified as chip manufacturing facilities either acquired by or under construction by Huawei. Among them, companies that may be blacklisted include Qingdao Si’En, SwaySure, and Shenzhen Pengsheng Technology Co., Ltd.

Furthermore, US officials are also considering action against companies like Changxin Memory Technologies (CXMT). A previous report from Bloomberg already indicated that the US Department of Commerce’s Bureau of Industry and Security (BIS) was contemplating placing CXMT on the entity list, which would restrict their access to US technology. Additionally, restrictions on five other Chinese companies are being considered, although the final list is yet to be confirmed.

Regarding this matter, the BIS and White House National Security Council declined to comment at that time.

In addition to companies involved in actual chip production, the United States may also consider sanctioning Shenzhen Pengjin High-Tech Co., Ltd. and SiCarrier. Per the report citing industry sources, there are concerns that these two semiconductor manufacturing equipment companies may act as agents to help Huawei obtain restricted equipment.

Currently, companies that have been listed on the entity list by the US Department of Commerce include Huawei, SMIC (Semiconductor Manufacturing International Corporation), and Shanghai Micro Electronics. Additionally, China’s other major memory manufacturer, Yangtze Memory Technology Corp, was added to this restriction list in 2022.

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• [News] US Government Considers Adding ChangXin Memory Technologies to Entity List, Imposing Further Sanctions on Chinese Firms
• [News] Bypassing U.S. Restrictions? CXMT Showcases GAA Technology for 3nm Chips

(Photo credit: iStock)

As TSMC and Intel slow down their plans for building fabs in the United States, the supply chain, according to a report from Nikkei Asia, is also said to delay in following suit, with semiconductor material suppliers like Topco Scientific, LCY Chemical, and Chang Chun Group among those named.

Per the same report citing statements from several industry sources, the construction of these fabs has been either postponed or significantly scaled back due to soaring costs of construction materials and labor, as well as a shortage of construction workers.

While some delays may be temporary, other fab construction projects are being thoroughly reassessed, with no specific timetable for resuming. Suppliers attribute the delays in fab construction plans to the slower-than-expected progress of Intel and TSMC in setting up their facilities.

The sources cited in the report also revealed that Solvay, a leading supplier of high-purity hydrogen peroxide for semiconductor use based in Belgium, has postponed the construction of its Arizona plant due to cost concerns and fears that Intel and TSMC’s expansion progress may take longer than expected.

Meanwhile, another major manufacturer of high-purity hydrogen peroxide for semiconductors, Taiwan’s Chang Chun Group, has significantly scaled back the construction of its new Arizona plant due to costs that have exceeded expectations by several times.

Regarding this issue, Chang Chun Group reportedly opted not to provide comments, while Solvay mentioned they are currently investigating the matter.

Topco Scientific has reportedly pointed out that it has acquired land in Arizona, USA. However, the company is currently adjusting its investment schedule for warehouse logistics in Arizona. This adjustment aligns with the progress and demand of its customers in setting up factories, as well as the local infrastructure planning, which includes water and power supply and road construction.

Per the report citing sources, TSMC originally planned to begin mass production at its Arizona plant in 2024. However, this timeline has now been postponed to 2025. Initial expectations for the second fab’s schedule were set for 2026, but it is now likely to be pushed back to 2027-2028

As per a previous report from TechNews, despite the United States outperforms Taiwan in various aspects for foundry construction, the primary obstacle is regulatory issues.

Due to the unique federal structure of the United States, foundry construction must comply with federal, state, and local regulations, resulting in an exceptionally complex regulatory process. Additionally, environmental policies pose obstacles to foundry construction, particularly due to stringent requirements for environmental protection

The report suggests that to enhance the United States’ competitiveness in the global semiconductor industry, the government needs to streamline regulatory processes, eliminate redundant regulations, and establish expedited pathways to accelerate semiconductor industry construction projects.

Additionally, there should be an acceleration of environmental review processes and investment in the development of alternative materials to ensure sustainable semiconductor material supplies.

With the continued growth in global semiconductor demand, the construction speed and efficiency of US semiconductor fabs will directly impact its position in the global market.

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(Photo credit: TSMC)

As the pressure from the United States to strengthen export controls on semiconductor manufacturing equipment to China continues to grow, as per a report from Yonhap News Agency (YNA), the United States has reportedly urged allies such as Japan, the Netherlands, Germany, and South Korea to join forces and expand the scope of their containment measures, extending to equipment, raw materials, optical components, and other areas.

While countries like the Netherlands, Japan, and Germany have yet to make their positions known, the same report indicates that the South Korean government, in efforts to maintain stability in its relationship with the United States, is considering cooperation with U.S. efforts to impose export controls on semiconductor equipment to China.

YNA’s report has indicated that, since October 2022, when the U.S. government announced a ban on American companies exporting equipment and technology essential for advanced semiconductor manufacturing to China, it has continuously urged its allies to implement similar levels of export controls on exports to China.

Sources cited by the report indicate that initially, the Netherlands and Japan, which have high levels of semiconductor technology, were the primary targets of U.S. pressure. However, starting from the second half of 2023, the pressure from the United States on South Korea has intensified, even directly naming specific South Korean companies.

In February this year, the U.S. Department of Commerce and the South Korean Ministry of Trade, Industry, and Energy reportedly held negotiations on this issue. Sources cited in YNA’s report revealed that the U.S. side is concerned that South Korea could become a loophole in its export controls on semiconductor technology to China, and South Korea is working to address U.S. concerns.

The same sources stated that although the South Korean government has not yet made a decision on this matter, considering national interests and taking into account the U.S. position, it is at least inclined to “partially” meet U.S. demands.

Per the same report, the South Korean government is also concerned that measures related to export controls on China will adversely affect the competitiveness of the South Korean semiconductor industry. South Korean companies’ semiconductor equipment technology is already inferior to that of the United States, Japan, and the Netherlands. If exports to China, particularly crucial ones, are further restricted, it will undoubtedly worsen the situation for the semiconductor industry in South Korea.

Yeo Han-koo, a senior researcher at the Peterson Institute for International Economics (PIIE) who formerly served as Director-General of Trade Negotiations at the South Korean Ministry of Trade, Industry, and Energy, noted that considering the recent dynamics in U.S.-China relations and international geopolitical factors, South Korea faces challenges in completely disengaging. However, South Korea aims to minimize losses for its companies to the greatest extent possible and is committed to exploring reasonable compromise solutions with the United States.

On the other hand, as per TrendForce’s previous report, China is focusing aggressively on mature process technologies (28nm and older), particularly in response to export controls on advanced equipment by the US, Japan, and the Netherlands. By 2027, China’s share in mature process capacity is expected to reach 39%, with room for further growth if equipment procurement proceeds smoothly.

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• [News] China’s Third Big Fund Reportedly Set to Inject USD 27 Billion to Counter US Chip Restrictions
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In recent years, influenced by complex international dynamics and the need to safeguard supply chain security, Southeast Asian countries such as Singapore, Malaysia, and Vietnam have become prime locations for numerous semiconductor giants to establish overseas operations. Now, the Philippines may join the ranks of these nations.

Recently, U.S. Secretary of Commerce Gina Raimondo addressed her desire to assist the Philippines in doubling its semiconductor facilities to lessen the geographic concentration of the global chip supply chain.

Previously, according to the press release of the U.S. Department of Commerce, Raimondo has announced the plan to invest USD 1 Billion in Philippines.

“The Indo-Pacific includes some of the most dynamic economies in the world. It was an honor to lead the first-ever trade mission of this nature to the Philippines and to underscore the immense potential, which is evident in the more than $1 billion of investments from this mission alone,” said Raimondo.

According to Taiwantrade’s Data, it has indicated that the semiconductor and electronics industry is the top-performing sector among the Philippines’ export commodities, accounting for approximately 60% of total commodity exports.

The semiconductor industry in the Philippines primarily focuses on the assembly and testing sector. With a high literacy rate and a young workforce proficient in English, the Philippines has become a significant assembly and testing hub for global semiconductor giants such as Amkor, Intel, ADI, and TI (Texas Instruments).

Geographically, the semiconductor industry in the Philippines is concentrated in four main regions: Manila, Calabarzon, Northern/Central Luzon, and Cebu. Among these regions, Manila stands out as the primary hub, hosting assembly and testing facilities for globally renowned companies like Amkor, Onsemi, as well as Toshiba’s hard drive assembly plant.

Currently, the Philippines has 13 semiconductor assembly, testing, and packaging facilities. Most of the products produced are exported to other regions for assembly or application. The integrated circuits (ICs) used in these facilities mainly come from Taiwan, the United States, and Japan, with finished products primarily exported to Singapore, China, and Japan.

However, the Philippines is not content with just the assembly and testing sector. In February of this year, it was previously reported by Philippine Board of Investments (BOI) in its press release, stating that the BOI would collaborate with the United States to expand its semiconductor capabilities, including the construction of its first fab.

The BOI aims to build a laboratory-scale fab. This facility will provide general manufacturing process technology to encourage local semiconductor startups and train semiconductor engineers.

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• [News] US Government Considers Adding ChangXin Memory Technologies to Entity List, Imposing Further Sanctions on Chinese Firms
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(Photo credit: Intel)