TrendForce reports that from 2023 to 2027, the global ratio of mature (>28nm) to advanced (<16nm) processes is projected to hover around 7:3. Propelled by policies and incentives promoting local production and domestic IC development, China’s mature process capacity is anticipated to grow from 29% this year to 33% by 2027. Leading the charge are giants like SMIC, HuaHong Group, and Nexchip, while Taiwan’s share is estimated to consolidate from 49% down to 42%.

Expansion predominantly targets specialty processes such as Driver ICs, CIS/ISPs, and Power Discretes, with second and third-tier Taiwanese manufacturers at the forefront

Within the Driver IC sector, the spotlight is on high voltage (HV) specialty processes. As companies aggressively pursue the 40/28nm HV process, UMC currently dominates, trailed by GlobalFoundries. Yet, SMIC’s 28HV and Nexchip’s 40HV are gearing up for mass production in 4Q23 and 1H24, respectively—narrowing their technological gap with other foundries. Notably, competitors with similar process capabilities and capacities, such as PSMC, and those without twelve-inch factories like Vanguard and DBHitek, are poised to face challenges head-on in the short term. This trend may also have long-term implications for UMC and GlobalFoundries.

In the realm of CIS/ISP, 3D CIS structure comprises a logic layer ISP and CIS pixel layer. The primary demarcation for mainstream processes is around 45/40nm range for the logic layer ISP, which continues to progress toward more advanced nodes. Meanwhile, the CIS pixel layer, along with FSI/BSI CIS, predominantly uses 65/55nm and above processes. Currently, TSMC, UMC, and Samsung are the frontrunners in this technology. Yet, Chinese players like SMIC and Nexchip are hot on their heels, swiftly closing the gap. Their ascent is further fueled by Chinese smartphone titans OPPO, Vivo, and Xiaomi. Additionally, domestic shifts prompted by governmental policies are positioning Chinese CIS companies like OmniVision, Galaxycore, and SmartSens to rally behind local production.

Power Discretes mainly encompass products like MOSFETs and IGBTs. Vanguard and HHGrace have been deeply involved in Power Discrete processes for some time, boasting a more comprehensive process platform and vehicle certification than many competitors. However, a wave of Chinese contenders, backed by national policies favoring EVs and solar initiatives, are ready to stake their claim, intensifying global competition in this sector. This includes mainstream foundries like HHGrace, SMIC, Nexchip, and CanSemi. Additionally, smaller Chinese IDMs and foundries, such as GTA and CRMicro, are also entering the competitive landscape. If China massively ramps up its production capacity, it will intensify global competition in Power Discrete manufacturing. The impact will not only spark price wars among local Chinese businesses but could also erode the order books and clientele of Taiwanese companies.

In a nutshell, while China actively courts both global and domestic IC designers to bolster its local manufacturing presence, the ensuing massive expansion could flood the global market with mature processes, potentially igniting a price war. TrendForce notes that as China’s mature process capacities continue to emerge, the localization trends for Driver IC, CIS/ISP, and Power Discretes will become more pronounced. Second and third-tier foundries with similar process platforms and capacities might face risks of client attrition and pricing pressures. Taiwan’s industry leaders, renowned for their specialty processes—UMC, PSMC, Vanguard to name a few—will find themselves in the eye of the storm. The battle ahead will hinge on technological prowess and efficient production yields.

According to a report by Taiwan Economic Daily, industry sources have revealed that due to sluggish terminal demand and market competition, TSMC and Vanguard have recently been progressively lowering their prices for 8-inch wafer foundry services, with reductions as high as 30%.

While 8-inch wafer foundry services do not constitute a major portion of TSMC’s revenue, the company has historically maintained a relatively steadfast pricing strategy, refraining from frequent price hikes or reductions. The current reduction of up to 30% has raised significant attention.

The report states that the semiconductor industry is experiencing a downturn in prosperity, resulting in decreased capacity utilization at wafer foundries. Within this context, demand for 8-inch wafers is weaker compared to 12-inch wafers, leading some manufacturers to see their 8-inch wafer utilization rates drop to around 60%.

Regarding the price reduction, analysts at Nomura Securities suggest that this move is primarily aimed at countering Texas Instruments (TI), a global leader in analog ICs, which has significantly lowered prices for products such as power management ICs, triggering a worldwide semiconductor price war that has impacted related industries. In response, IC design companies are hoping for price reductions from foundries such as TSMC and to lower costs and compete against TI.

IC design firms have indicated that they have not received any official notification of price reductions for 8-inch wafer foundry services. They emphasized that TSMC has never implemented such a substantial reduction of up to 30% since its establishment, raising doubts about the authenticity of the news. TSMC has declined to comment on pricing matters.

(Photo credit: TSMC)

Leading semiconductor companies are making significant strides in global expansion with the announcement of two new fabrication facilities. TSMC is set to greenlight a factory in Germany, while GlobalFoundries plans to establish its first 12-inch wafer plant in Singapore.

TSMC’s Bold Move: Germany’s Green Light

TSMC from its presence in the USA, China (Shanghai and Nanjing), to Japan (Kumamoto City), TSMC’s global manufacturing footprint is expanding. Reuters reported on August 7 that TSMC’s board is inclined to approve the construction of a plant in Dresden, Germany. The German government pledges a substantial 5 billion euros (about $5.49 billion USD) to support the facility. However, the German Ministry of Economy refrains from commenting on the matter.

TSMC has been negotiating with the Saxony German state since 2021 to establish a collaborative FAB plant. In partnership with Bosch, Infineon, and Onsemi, TSMC aims to utilize the Dresden plant primarily for automotive chip production. Pending board approval, this venture could involve financing discussions with Berlin, ultimately requiring European Commission endorsement. TSMC, Intel, and Wolfspeed stand out among chip manufacturers seeking government assistance for European manufacturing ventures.

GlobalFoundries Poised to Build 12-Inch Wafer Plant in Singapore

According to udn.com, GlobalFoundries is set to make a substantial investment in the establishment of a 12-inch wafer fabrication plant in Singapore. The project’s funding could exceed NT$100 billion (approximately $3.2 billion USD). Reports suggest that this Singaporean facility will focus on producing 28-nanometer chips, with a potential completion date as early as 2026.

Industry experts note that GlobalFoundries’ move to set up a 12-inch facility in Singapore implies a significant shift in the competitive landscape. TSMC, UMC, PSMC, and GlobalFoundries – the four major semiconductor foundries – will all possess 12-inch production capabilities. Additionally, each of these companies has international expansion plans for such facilities. Notably, TSMC’s ventures span across the USA and Japan, UMC, and GlobalFoundries are both targeting Singapore, while PSMC’s strategy involves establishing a plant in Japan in collaboration with local partners.

Major Manufacturers Expand Against the Current Downturn

TSMC has been proactive in its expansion strategy, unveiling plans for ten new facilities in the past two years. These include 5 wafer plants and 2 advanced packaging facilities in Taiwan, alongside 3 overseas wafer plants. Despite the industry’s current challenges, TSMC’s expansion momentum remains strong, driven by a heightened focus on global manufacturing diversity.

TSMC is well aware of the potential risks tied to significant expansion efforts. In its latest annual report, the company acknowledges that expanding on a global scale demands substantial resources, highlighting possible challenges like rising costs, workforce shortages, disasters, land scarcity, cyber threats, government support, cultural differences, intellectual property protection, and tax variations.

Expanding during a semiconductor downturn has become a strategic approach for the foundry players. Typically, a fab construction takes 2 to 4 years, with equipment installation lasting 0.5 to 1 year and production ramp-up stretching 1 to 2 years. Looking ahead, semiconductor foundries are gearing up for a fresh wave of capacity release throughout 2024 and 2025.

Despite the industry’s ongoing slump, encouraging signs suggest that the downturn might be reaching its conclusion. Industry experts are cautiously optimistic, anticipating the arrival of the next upswing in the cycle.

(Source: https://mp.weixin.qq.com/s/4Xu_uc58kG85E_6R4Y3qhQ)

According to TrendForce, Taiwan is crucial to the global semiconductor supply chain, accounting for a 26% market share of semiconductor revenue in 2021, ranking second in the world. Its IC design and packaging & testing industries also account for a 27% and 20% global market share, ranking second and first in the world, respectively. Firmly in the pole position, Taiwan accounts for 64% of the foundry market. In addition to TSMC possessing the most advanced process technology at this stage, foundries including UMC, Vanguard, and PSMC also have their own process advantages. Under the looming shadow of chip shortages caused by the pandemic and geopolitical turmoil in the past two years, various governments have quickly awakened to the fact that localization of chip manufacturing is necessary to avoid being cut off from chip acquisition due to logistics difficulties or cross-border shipment bans. Taiwanese companies have ridden this wave to become partners that governments around the world are eager to invite to set up factories in various locales.

Currently, 8-inch and 12-inch foundries are dominated by 24 fabs in Taiwan, followed by China, South Korea, and the United States. Looking at new factories plans post 2021, Taiwan still accounts for the largest number of new fabs, including six new plants in progress, followed in activity by China and the United States, with plans for four and three new fabs, respectively. Due to the advantages and uniqueness of Taiwanese fabs in terms of advanced processes and certain special processes, they accepted invitations to set up plants in various countries, unlike non-Taiwanese foundries who largely still build fabs locally. Therefore, Taiwanese manufacturers have successively announced factory expansions at locations including the United States, China, Japan, and Singapore in addition to Taiwan in consideration of local client needs and technical cooperation.

The focus of Taiwan’s key technologies and production expansion remains in Taiwan, accounting for 44% of global wafer production capacity by 2025

In 2022, Taiwan will account for approximately 48% of global 12-inch equivalent wafer foundry production capacity. Only looking at 12-inch wafer production capacity with more than 50% market share, the market share of advanced processes below 16nm (inclusive) will be as high as 61%. However, as Taiwanese manufacturers expand their production globally, TrendForce estimates that the market share held by Taiwan’s local foundry capacity will drop slightly to 44% in 2025, of which the market share of 12-inch wafer capacity will fall to 47% and advanced manufacturing processes to approximately 58%. However, Taiwanese foundries’ recent production expansion plans remain focused on Taiwan including TSMC’s most advanced N3 and N2 nodes, while companies such as UMC, Vanguard, and PSMC retain several new factory projects in Hsinchu, Miaoli, and Tainan.

TrendForce believes, since Taiwanese foundries have announced plans to build fabs in China, the United States, Japan, and Singapore, and foundries in numerous countries are also actively expanding production, Taiwan’s market share of foundry capacity will drop slightly in 2025. However, semiconductor enclaves do not come together quickly. The integrity of a supply chain relies on the synergy among upstream (raw materials, equipment, and wafers), midstream (IP design services, IC design, manufacturing, and packaging and testing), and downstream (brands and distributors) sectors. Taiwan has advantages in talent, geographical convenience and industrial enclaves. Therefore, Taiwanese foundries still tend to focus on Taiwan for R&D and production expansion. Looking at the existing blueprint for production expansion, Taiwan will still control 44% of the world’s foundry capacity by 2025 and as much as 58% of the world’s capacity for advanced processes, continuing its dominance of the global semiconductor industry.

An earthquake that was around magnitude 6.0 on the Richter scale occurred off the east coast of Taiwan at 5:46PM local time on January 3, 2022. As most local DRAM and foundry fabs are located in the northern and central parts of the island, TrendForce’s latest investigations reveal no notable damages to the equipment from the fabs. Therefore, the production side is expected to continue normal operation, and the actual impact of the earthquake on the output of Taiwan’s DRAM and foundry industries will likely be limited. Taiwan’s memory fabs, including those operated by MTTW, Nanya, and other smaller semiconductor companies, collectively account for about 21% of the global DRAM production capacity. In the foundry industry, Taiwan’s fabs, including those operated by TSMC, UMC, Vanguard, PSMC, etc., together make up as much as 51% of the global production capacity.

Regarding the current state of the DRAM market, it is in midst of the conventional off-season. However, the recent easing of component gaps in the supply chain is generating some stock-up activities in different application segments and thus bolstering the overall demand. The headwinds of the off-season are not as strong as usual. Also, there are now concerns brewing in the wider memory market about the supply side being affected by the COVID-19 lockdown in the Chinese city of Xi’an. Consequently, memory spot prices have been registering daily hikes lately. It is worth noting that increases in DRAM spot prices have been more significant than the increases in NAND Flash spot prices. Regarding DRAM contract prices, TrendForce for now maintains its original forecast of QoQ drops in the 8-13% range for 1Q22. However, the latest earthquake that struck Taiwan could affect DRAM buyers’ behavior at any time. How contract prices will actually end up is something that requires further observation. As for DRAM spot trading, the memory spot market of Mainland China was still in midst of the year-end holiday on January 3. Hence, spot traders were passive for the most part. TrendForce will continue monitoring the spot market to see if the earthquake is going to be a positive driver going forward.

Turning to the current state of the foundry market, the chip demand related to some categories of end products has slowed down a bit recently because of seasonality. However, demand remains quite strong for chips that were previously in short supply, such as PMIC, Wi-Fi SoC, etc. Foundry fabs on the whole are still operating with a fully loaded capacity because demand continues to outstrip supply. The fabs of Taiwan-based foundries, including TSMC, UMC, PSMC, and Vanguard, are concentrated in Hsinchu, Taichung, and Tainan. In those places, an earthquake intensity scale of 3 or under was recorded. As such, no foundry fab in Taiwan has halted operation because of the earthquake, and all fabs are operating normally at the moment.

For more information on reports and market data from TrendForce’s Department of Semiconductor Research, please click here, or email Ms. Latte Chung from the Sales Department at lattechung@trendforce.com