TrendForce’s latest research indicates that, as production cuts to DRAM and NAND Flash have not kept pace with weakening demand, the ASP of some products is expected to decline further in 2Q23. DRAM prices are projected to fall 13~18%; NAND Flash is expected to fall between 8~13%.

DRAM Spot Market

In the spot market, the trajectory of prices of DDR5 chips is going to be a highlight in the short term. Some sellers are now willing to lower quotes on DDR5 products that have been enjoying price hikes for many consecutive days. However, there have been few to no actual transactions, so TrendForce will continue to closely monitor changes in the prices of these products. As for spot prices of DDR3 and DDR4 products, they are still on a downward trajectory with no sign of easing. The average spot price of mainstream chips (i.e., DDR4 1Gx8 2666MT/s) fell by 1.33% from US$1.575 last week to US$1.554 this week.

NAND Flash Spot Market
Suppliers continue to enlarge in production cuts. Despite the insignificant increase in spot market demand, the continuously shrinking output of small-capacity wafers, as well as the attempt at price revitalization among a number of suppliers, have pulled up demand and transactions of low-priced inventory within the spot market, which led to a small price increment. However, mainstream wafer prices have yet to suspend in decline. 512Gb TLC wafer has dropped by 0.21% this week, arriving at US$1.427.

YMTC has officially notified a 3~5% price increase for NAND Flash in mid-May. However, the initial impact of the price hike is expected to be felt in the enterprise market, and it may take some time to reflect in the consumer spot market.

The semiconductor industry is in the midst of a correction period aimed at tackling inventory challenges, and the memory sector is feeling the impact. Major players in global memory manufacturing, including Samsung, SK Hynix, Micron, and YMTC, have recently disclosed substantial cuts in CAPEX, ranging from 45~50% starting from 4Q22. The most recent financial reports from Micron and Samsung further underscore the industry’s downward trend.

TrendForce highlights that YMTC’s decision to raise prices comes amidst market conditions marked by substantial oversupply in the second quarter. Despite Samsung’s efforts to curtail production, the positive effects of this reduction are not anticipated to materialize until the latter part of the year. Consequently, experts predict a more substantial decline in contract prices for the second quarter of 2023 than initially expected.

The market situation in 2Q23 is still oversupplied, leading to further price declines. Since October of last year, the market transaction price for wafers has been lower than the supplier’s cash cost due to selling pressure. Some suppliers used the opportunity when Samsung announced production cuts to raise the wafer price, which is likely why YMTC made this announcement. TrendForce predicts that as demand gradually recovers in the second half of the year, wafer prices will become more resilient. (Photo credit: YMTC LinkedIn)

After the Chinese holidays, solar-related materials continued to decline, with the exception of module prices which remained nearly flat. Prices for other materials such as cells, wafers, and polysilicon all decreased.

Polysilico

Polysilicon prices have continued to decline since the Labor Day holiday, with mono-Si compound feedings and mono-Si dense materials now priced at RMB 158/kg and RMB 155/kg, respectively. Downstream wafer businesses are trying to reduce their polysilicon inventory to avoid further losses from price drops. The increase in polysilicon output is weakening price protection for polysilicon companies, with some dumping their stocks, further accelerating the price drop. The ramp-up phase has resulted in lower quality polysilicon, creating an apparent price difference compared to high-quality polysilicon. The drop in prices is expected to continue.

Wafers

Wafer prices have dropped for nearly two weeks, guided by leading wafer businesses. M10 and G12 now cost a respective mainstream price of RMB 5.4/pc and RMB 7.4/pc. Zhonghuan recently announced a more than 8% reduction in its wafer prices following LONGi’s announcement of an approximate 3% drop in wafer prices. The cautious attitude towards procurement in response to falling prices has led to sluggish market transactions. The cell segment’s reluctance to purchase has led to shipment difficulties and an inventory build-up. Combined with the ongoing decline in polysilicon prices, wafer prices are expected to continue to fall in the short term.

Cells

Cell prices have dropped slightly following the Labor Day holiday, with M10 and G12 cells now priced at RMB 1.04/W and RMB 1.1/W respectively. The reduction in upstream polysilicon and wafer prices, along with price suppression from downstream module makers, contributed to the decrease. However, the balanced supply and demand of cells prevented a significant drop, allowing cell businesses to maintain partial profitability. Further reductions in cell prices may occur due to ongoing cost reductions upstream and price pressure from module makers, but the equilibrium between upstream and downstream sectors could slow the decrease. M10 mono-Si TOPCon cell prices have increased due to a gradual rise in market transactions, now priced at RMB 1.18/W.

Modules

Module prices are holding steady in the short term, with 182 & 210 mono-Si single-sided PERC modules priced at RMB 1.67/W and RMB 1.68/W respectively, and 182 & 210 bifacial double-glass mono-Si PERC modules at RMB 1.69/W and RMB 1.7/W. Upstream price reductions have yet to affect the module segment due to the retention of profitability for the cell segment and the traditional peak season for the PV industry. Despite the price-suppressing approach from the end sector, first-tier module makers are stabilizing their prices, and overseas demand is strong. Overall, module prices are expected to remain sturdy in the short term. (Image credit: EnergyTrend)

Samsung recently announced that they will ahead of TSMC in the foundry market within 5 years. At the same time, Intel also claimed to become the second-largest player in the market before 2030. Currently, both Samsung and TSMC are adapting 3nm process to do the chip manufacturing, with the technology of GAA(Samsung) and FinFET(TSMC) respectively.

Samsung sees GAA technology as a crucial key to surpassing TSMC. Currently, Samsung’s 4nm lags behind TSMC by about 2 years, and its 3nm is about a year behind. However, this situation will change when TSMC turns to 2nm. Industry insider sources indicate that TSMC plans to use GAA technology in 2nm process, and Samsung believes that they can seize the chance to catch up with TSMC since TSMC may have a hard time when turning to 2nm process.

Industry insiders have revealed that AMD has shifted some of its 4nm CPU chip orders from TSMC to Samsung. It is reported that AMD has signed an agreement with Samsung to manufacture some of its mobile SoC by using Samsung’s 4nm node, and Samsung may also manufacture AMD’s Chromebook APU.

The Fight in the Foundry Market is On

According to TrendForce, the top 10 global foundry players in 4Q22 with TSMC account for 58.5% of market share by revenue, far ahead of Samsung’s 15.8%. Industry insiders suggest that Samsung still has a long way to go to catch up with TSMC. Some sources say that TSMC’s 2nm process will be mass-produced as scheduled in 2025, while Samsung’s plans are still to be observed.

Intel is also striving for the top spot in the wafer foundry market. Since the beginning of 2021, Intel has implemented a series of measures in its foundry business after announcing its “IDM 2.0” strategy. Last July, Intel stated that it will manufacture chips for MediaTek, and the first batch of products will be produced within the next 18 to 24 months using more mature manufacturing technology (Intel 16). In addition, Intel said that Qualcomm and Nvidia are also interested in having them manufacture their chips. To regain its leading edge in chip manufacturing, Intel has unveiled its 5 process technology stages to be launched in the next few years, including 10nm, 7nm, 4nm, 3nm, and 20A.

And TSMC has no competitive relationship with their clients by not doing the wafer design, apparently, this is also a significant advantage for TSMC and other foundry manufacturers. In recent years, more companies have recognized the importance and highly profitable nature of foundry manufacturing, leading to the independent establishment of foundry manufacturing operations. Samsung and Intel have also followed this trend, as foundry manufacturing can optimize production technology and provide major companies with more opportunities for trial and error.

According to TrendForce research, driven by strong demand for 5G mobile phones, base stations, automobiles, and HPCs, the global output value of packaging and testing (including foundry and IDM) reached US$82.139 billion in 2021, or 25.83% YoY. This upward momentum is forecast to continue in 2022, taking output value to US$101.185 billion in 2022, or 23.19% YoY. From the perspective of regional distribution, China’s IC packaging and testing output value in 2021 was approximately US$39.443 billion, increasing 31.7% compared with US$29.941 billion in 2020, becoming the world’s fastest-growing major market in terms of packaging and testing output value.

Shanghai pandemic lengthens overall lead time, hinders China’s packaging and testing growth in 2Q22

In 2Q22, Shanghai was locked down due to the COVID-19 pandemic. Although wafer fabs and packaging and testing plants were still operating normally, the pandemic hindered logistics and the materials required for packaging could not be effectively shipped from Shanghai, affecting transportation efficiency and logistics costs to a certain degree. Overall, China’s packaging and testing industry was not significantly affected by the pandemic in 1Q22 but, in 2Q22, the industry will bear the brunt of the COVID-19 situation, with packaging and testing companies experiencing prolonged overall lead times and sluggish revenue growth.

NEVs and HPCs to become new growth drivers, fabs and packaging and testing companies accelerate deployment

The growth rate of smartphones, a core driving force behind IC packaging and testing output value, is slowing down. Since smartphone shipments peaked at 14.575 million units in 2017, volume has not surpassed this number in the ensuing years. Even though the upgrade from 4G to 5G brought about a wave of replacements, the overall smartphone market has reached maturity, with slowing growth or even negative growth, so its demand on wafer manufacturing and packaging and testing is likewise slowing down.

Aside from mobile phones, growth in HPC and new energy vehicles (NEV) is becoming a new revenue engine. At present, the world’s major automobile production countries are accelerating the penetration rate of NEVs, and packaging and testing companies are also accelerating their investment in the automotive and HPC sectors. From the perspective of fabs, TSMC’s HPC revenue accounted for 41% of total packaging and testing revenue in 1Q22, surpassing mobile phones for the first time and becoming the largest source of the company’s packaging and testing revenue.

（Image credit: Unsplash）