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    2024-09-05

    [News] TSMC Plans Rapid CoWoS Expansion Through 2026 in Response to Client Demand

    Semiconductors

    With advanced packaging capacity at TSMC being tight, the expansion of CoWoS has garnered significant attention. According to a report from Economic Daily News, Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, noted at SEMICON Taiwan 2024 that the foundry giant is rapidl...

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