AI memory wall is driving HBM and DDR5 demand, sparking a supercycle in 3Q25. Capacity shortages force devices to hike prices or cut specs. When will the cycle end?
The AI Memory Playbook →
Under US restrictions, China is advancing semiconductor equipment self-sufficiency, with EUV as a key bottleneck relative to ASML’s lithography.
Inside China’s Chain Strategy →
Glass-based Micro LED, advanced by Samsung and AUO, benefits from a mature supply chain. LEDoS, still led by JBD, may become the new mainstream once matured.
In-Depth Insights Micro LED →
Ethernet is poised to return as the mainstream in Scale-Out data centers, while InfiniBand stays strong in HPC. Broadcom and NVIDIA are competing for dominance.
ASIC growth may outpace GPU in 2026, putting NVIDIA under pressure. The battle has moved from chip performance to interconnects, switches, software, and ecosystem.
AI is driving data center power use, could double in 5 years! Enterprises face rising costs and ESG pressure. How can they boost efficiency and cut power?
4 major North American CSPs are ramping up investment in AI infrastructure to stay competitive. This article explores AI infra trends through their strategies.
