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TrendForce’s latest analysis of the HBM industry reveals that as the ongoing expansion of AI infrastructure continues to fuel GPU demand, NVIDIA’s upcoming Rubin platform is expected to become a major catalyst for HBM4 adoption once mass production begins. The three leading memory suppliers—Samsung, SK hynix, and Micron—are now in the final stages of HBM4 validation, with completion anticipated by 2Q26.
Google’s next-generation TPU, Ironwood, integrates a 3D Torus network topology with the Apollo optical circuit switch (OCS) all-optical network, marking a major step forward in AI data-center interconnect design. TrendForce’s latest research on the high-speed interconnect market indicates that this architecture will directly address the surging compute and bandwidth demands driven by large-scale AI workloads.
The current AI surge is anticipated to boost both the memory and wafer foundry sectors to record-breaking revenues by 2026, based on TrendForce’s recent data. Limited supply and rapidly increasing prices are likely to grow the memory market's total worth to $551.6 billion. Meanwhile, the global foundry market is also expected to reach a new peak of $218.7 billion, but the memory industry's scale will have more than doubled that of wafer foundries.
According to TrendForce's latest findings, the global MLCC industry will show a more polarized landscape in 1Q26 due to ongoing political and economic turbulence. While the U.S. tariffs and escalating geopolitical risks continue to increase supply chain uncertainty, the market for high-end MLCCs is sharply rebounding, driven by the commercialization of embodied AI applications. In contrast, the mid- to low-end MLCC segments are struggling due to seasonal downturns and rising raw material costs, which dampen demand for traditional consumer electronics and increase operational challenges for manufacturers.
1Q26 conventional DRAM contract prices raised to +90–95% QoQ; NAND Flash to +55–60% QoQ. CSPs, server OEMs, and PC OEMs broadly face DRAM supply gaps; PC DRAM prices are expected to at least double QoQ in 1Q26. Strong North American CSP demand lifts enterprise SSD orders; prices projected to rise 53–58% QoQ in 1Q26.
