Press Center

Press Releases




HBM4 Validation Expected in 2Q26; Three Major Suppliers Poised to Shape NVIDIA Supply Landscape, Says TrendForce

13 February 2026

TrendForce’s latest analysis of the HBM industry reveals that as the ongoing expansion of AI infrastructure continues to fuel GPU demand, NVIDIA’s upcoming Rubin platform is expected to become a major catalyst for HBM4 adoption once mass production begins. The three leading memory suppliers—Samsung, SK hynix, and Micron—are now in the final stages of HBM4 validation, with completion anticipated by 2Q26.

Sharp to Halt Kameyama K2 Plant Operations in August, Potentially Disrupting the Supply of Apple IT Panels and E-Paper, Says TrendForce

11 February 2026

On February 10th, Sharp announced plans to halt production at its K2 facility, a Gen 8 LCD plant in Kameyama (2160 x 2460 mm), and to seek a potential buyer for the site. The K2 plant has been a key pillar of Sharp’s display business, producing panels for notebooks, tablets, e-paper devices, and smartphones, and has long underpinned Sharp’s role as Apple’s third-largest IT panel supplier. It is also a critical source of oxide backplanes for e-paper applications. If output at the Kameyama K2 plant is scaled back as planned, the short-term supply of Apple’s MacBook and iPad models—as well as e-paper products—could face disruption.

Memory Price Surge Intensifies Retail Pricing Pressure, Putting Global Smartphone Production at Risk of a Sharp Decline in 2026, says TrendForce

11 February 2026

TrendForce’s latest smartphone industry research predicts that soaring memory prices are set to weigh heavily on global smartphone production in 2026. Total output is forecast to decline 10% YoY to approximately 1.135 billion units. With memory prices showing no clear signs of easing, the growing gap between higher retail prices and consumer price tolerance is expected to further dampen end demand.

Google’s High-Speed Interconnect Architecture to Push 800G+ Optical Transceiver Share Past 60% by 2026, Says TrendForce

10 February 2026

Google’s next-generation TPU, Ironwood, integrates a 3D Torus network topology with the Apollo optical circuit switch (OCS) all-optical network, marking a major step forward in AI data-center interconnect design. TrendForce’s latest research on the high-speed interconnect market indicates that this architecture will directly address the surging compute and bandwidth demands driven by large-scale AI workloads.

AI-Fueled Supercycle Propels Memory Market Revenue to More Than Twice That of Foundry Industry, Says TrendForce

9 February 2026

The current AI surge is anticipated to boost both the memory and wafer foundry sectors to record-breaking revenues by 2026, based on TrendForce’s recent data. Limited supply and rapidly increasing prices are likely to grow the memory market's total worth to $551.6 billion. Meanwhile, the global foundry market is also expected to reach a new peak of $218.7 billion, but the memory industry's scale will have more than doubled that of wafer foundries.


  • Page 1
  • 815 page(s)
  • 4071 result(s)


Get in touch with us