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[News] Samsung Foundry Reportedly Expands Its ‘Packaging Coalition’ by Adding Ten New Members This Year
Samsung has been strengthening its alliance regarding the semiconductor packaging technology, attempting to narrow the technological gap with TSMC, according to the latest report by Business Korea.
Citing industry sources, Business Korea noted that Samsung is expected to expand its 2.5D and 3D MDI (Multi Die Integration) Alliance to include 30 partners this year, an increase of 10 within just one year.
The MDI Alliance, launched by Samsung Electronics in June, 2023, was established to address the rapid growth in the chiplet market for mobile and HPC applications, in which Samsung will collaborate with its partner companies as well as major players in memory, substrate packaging and testing.
According to Samsung’s press release, the MDI Alliance leads innovation in stacking technology by forming a packaging technology ecosystem for 2.5D and 3D Heterogeneous Integration. Together with partners across the ecosystem, Samsung will provide a one-stop turnkey service to better support customers’ technological innovation.
As demands from AI and data centers have been heated up, stacking and combining different chips are viewed as more cost-effective and efficient than further reducing the circuit size within a chip, which makes 2.5D and 3D IC packaging technology coveted by tech giants like NVIDIA and AMD.
Business Korea further stated that while Samsung does benefit from offering a ‘one-stop’ solution that integrates foundry, HBM, and packaging, successful collaboration is crucial to address the various software challenges that arise from chip integration. That is to say, to overcome this challenge, Samsung has formed a coalition with design firms, post-processing companies, and EDA (Electronic Design Automation) tool providers.
On the other hand, TSMC, the current market leader in 2.5D IC and 3D IC packaging, announced the new 3Dblox 2.0 open standard and its major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance in September, 2023, while AMD confirmed its collaboration with TSMC on 3D IC packaging for the GPU giant’s MI300 AI accelerators, according to a press release by TSMC.
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(Photo credit: Samsung)
