LEDinside: Micro LED Key Technology Development Map Analysis: Transfer Technology

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According to the latest ‘ 1Q17 Micro LED Next Generation Display Industry Member Report’ by LEDinside, Micro LED key technology development cover four sectors, including epi wafer and chip, transfer, bonding, and color conversion.

Transfer Technology

The core technology of thin film transfer is how to massively pick up micrometer-scale epitaxy, currently, the pick-up can be implemented through physical and chemical methods. Taking the physical method for example, LuxVue pick up micro devices through electrostatic adsorption. And the chemical method represented by X-Celeprint, who utilizes van der Waals force to pick up with the medium of Stamp. Moreover, many manufacturers developed a number of pick up methods respectively.

Another core technology of thin film transfer is how to select the ideal micrometer-scale epitaxy for pick-up, for example, generally selecting the target object through controlling the strength of pick-up force like the above mentioned electrostatic force or van der Waals force. In addition, Sony selects the specified target object through laser ablation technology.

Finally, regarding bonding, it is generally used to connect the gold wire for LED chip internal circuit to substrate and ensure the circuit in an energized state before packaging. However, the Micro LED chip is so tiny that it is necessary to integrate substrate through other methods rather than the gold wire bonding. Therefore, the focus of technology development in future lies in that what material will be used for bonding and transferring.

Author: Roger, Skyve, Joanne, Joey / LEDinside

 

1Q17 Micro LED Next Generation Display Industry Member Report- Outline

 

What is Micro LED?

<!–[if !supportLists]–> p   <!–[endif]–>Definition of Micro LED Display

<!–[if !supportLists]–> p   <!–[endif]–>Micro LED Display Manufacturing Process

<!–[if !supportLists]–> p   <!–[endif]–>LED Display Applications- Backlight and Pixel Light

<!–[if !supportLists]–> p   <!–[endif]–>LED Larger than Pixel-Backlight

<!–[if !supportLists]–> p   <!–[endif]–>Pixel Larger than LED-Micro LED

<!–[if !supportLists]–> p   <!–[endif]–>Combination of High Density Circuit and High Density Light Source

<!–[if !supportLists]–> p   <!–[endif]–>Future of Display Technology To Enter the Era of Self-Emitting

<!–[if !supportLists]–> p   <!–[endif]–>LCD v.s. OLED v.s. Micro LED Analysis

<!–[if !supportLists]–> p   <!–[endif]–>Micro LED to Open Up New Frontier of Display Technology

 

Micro LED Key Technology Development Map and Analysis

<!–[if !supportLists]–> p   <!–[endif]–>Micro LED Key Technology Development Map

<!–[if !supportLists]–> p   <!–[endif]–>Epi Wafer and Chip Technology

<!–[if !supportLists]–> p   <!–[endif]–>Transfer Technology

<!–[if !supportLists]–> p   <!–[endif]–>Transfer Technology- Pick Up

<!–[if !supportLists]–> p   <!–[endif]–>Transfer Technology- Selectivity

<!–[if !supportLists]–> p   <!–[endif]–>Transfer Technology- Placement

<!–[if !supportLists]–> p   <!–[endif]–>Color Conversion

 

Micro LED Value Chain and Transfer Manufacturer Analysis

<!–[if !supportLists]–> p   <!–[endif]–>Micro LED Value Chain- Micro LED / QD Phosphor / Transfer / Panel / Driver IC

<!–[if !supportLists]–> p   <!–[endif]–>Major Micro LED Supply Chain and the Focus of Patent Layout

<!–[if !supportLists]–> p   <!–[endif]–>Definition on Patent Classification

<!–[if !supportLists]–> p   <!–[endif]–>LuxVue- Electrostatic Adsorption Transfer Yet to Be a Perfect Solution

<!–[if !supportLists]–> p   <!–[endif]–>LuxVue- Patent Strengthens the Stability of Arrays of Micro Devices

<!–[if !supportLists]–> p   <!–[endif]–>X-Celeprint- Focuses on Transfer Technology, Followed By Display Technology

<!–[if !supportLists]–> p   <!–[endif]–>X-Celeprint- Problems in μTP Transfer Shall Be Settled One by One

<!–[if !supportLists]–> p   <!–[endif]–>X-Celeprint- Active v.s. Passive Matrix Technology Products Planning

<!–[if !supportLists]–> p   <!–[endif]–>Sony- Constantly Develops Micro LED Technology

<!–[if !supportLists]–> p   <!–[endif]–>Sony- Selects Specified Devices for Transfer through Laser Ablation Technology

<!–[if !supportLists]–> p   <!–[endif]–>ITRI- Actively Develops Transfer, Adopting Active Matrix Technology

<!–[if !supportLists]–> p   <!–[endif]–>ITRI– Pick up 1μm-100μm Micro Device through Transfer Technology

<!–[if !supportLists]–> p   <!–[endif]–>PlayNitride- Applies for Patents on PixeLED and Transfer Technology

<!–[if !supportLists]–> p   <!–[endif]–>PlayNitride- Specializes in LED Chip and Transfer Technologies

<!–[if !supportLists]–> p   <!–[endif]–>Mikro Mesa- Minimum Size of Chip is 3μm with Vertical LED Chip Structure

<!–[if !supportLists]–> p   <!–[endif]–>Mikro Mesa- Film Transfer Patent

<!–[if !supportLists]–> p   <!–[endif]–>Ostendo Technology Inc. USA- Qantum Photonic Imager For Holographic Displays

<!–[if !supportLists]–> p   <!–[endif]–>Ostendo Technology Inc. USA- QPI Patent Allows to Achieve RGB LED on Single LED Epi-wafer

<!–[if !supportLists]–> p   <!–[endif]–>Patent Analysis- Transfer & Bonding

<!–[if !supportLists]–> p   <!–[endif]–>Patent Analysis- Micro LED v.s. Substrate

 

If you would like to know more details, please contact:

Joanne Wu (Taipei)

joannewu@trendforce.com

+886-2-8978-6488 ext. 912