[News] TSMC and Samsung: Close Combat on FOPLP, with Different Panel Materials for Packaging

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TSMC and Samsung are not just archrivals in the foundry market. They also confront each other in an emerging sector, the Fan-Out Panel-Level Packaging (FOPLP) technology. According to South Korean media outlet ETnews, the two semiconductor giants, while both eyeing FOPLP as a secret weapon to high-performance computing packaging for AI, approach the tech with different core materials.

According to a previous report from Commercial Times, TSMC Chairman C.C. Wei confirmed that the company has established an FOPLP R&D team and production line, with achievements expected to be seen within three years.

On the other hand, Business Korea noted that Samsung is making strides in the PLP field, as the tech giant acquired the business from Samsung Electro-Mechanics in 2019.

The two companies reportedly adopt different panel materials for FOPLP. As per ETnews, Samsung is expected to choose plastic (organic) as the core material, which is commonly used in PCBs. In contrast, TSMC would focus on using glass as the panel material.

Samsung: A Veteran in Plastic Panels

While the panel plays a crucial role in supporting the semiconductor die and facilitating the packaging process, the choice between plastic and glass will result in differences in performance and processing, which could lead to variations in the outcomes of their packaging businesses, as per ETnews.

To elaborate a bit, the ETnews report notes that FOPLP uses square panels instead of round wafers, allowing it to eliminate chip waste at the corners. For example, with a 600×600mm panel, the packaging method is possible to produce 5-6 times more chips than with a 300mm (12-inch) wafer, the report suggests.

Given that Samsung has utilized plastic panels on packaging mobile APs and PMICs, it is likely to stick with the material when applied FOPLP to AI chip packaging, the report adds, noting that the company has reportedly begun related FOPLP research and development under the leadership of the AVP development team last year.

TSMC: Teams up with Innolux on Glass Panels

In contrast, TSMC is considering glass panels on FOPLP. Though the Taiwanese foundry giant has been using CoWoS (Chip-on-Wafer-on-Substrate) 2.5D packaging technology to package AI semiconductors for clients like NVIDIA, it is preparing for FOPLP due to production capacity limitations and cost concerns, the ETnews report notes.

TSMC’s acquisition of Taiwanese panel manufacturer Innolux’s plant in August, thus, is regarded as a critical move to advance in FOPLP production. The two companies are likely to collaborate with on glass panel technology, as per the report.

The report notes that using glass for FOPLP panels is considered advantageous in terms of reducing issues like foreign particles and panel warping. However, handling glass is also regarded as challenging, making the process more difficult.

According to the analysis by TrendForce, the main advantages of FOPLP are lower unit costs and larger packaging sizes, but the technology and equipment systems still need development, and the commercialization process is highly uncertain.

The estimated mass production timeline for FOPLP packaging technology in consumer IC and AI GPU applications is the second half of 2024 to 2026 and 2027–28, respectively, as per TrendForce. Is it TSMC or Samsung that prevails in the FOPLP battle? Only time will tell.

Read more

• [News] TSMC Pushes for FOPLP Mass Production by 2027, Reportedly Eyeing on Innolux’s Plant
• [News] TSMC Reportedly Forms a Team on FOPLP Development, with Mini Line on the Road

(Photo credit: Samsung)